Abstract: A method for registering a plurality of substrates that are retained on a workpiece carrier onto an exposure mask for carrying out a photolithography process has the steps of registering and immobilizing the exposure mask onto an alignment panel having precisely fitting passthrough orifices for reception of one substrate for each passthrough orifice and inserting into the passthrough orifices of the alignment panel the substrates that are retained on the workpiece carrier.

Abstract: Proposed is a method for manufacturing a thin-layer component, in particular a thin-layer, high-pressure sensor, as well as a thin-layer component, where a resistive layer for forming measuring elements, in particular strain gauges, is deposited on an electrically non-conductive surface of a diaphragm layer, a contact-layer system for electrically contacting the measuring elements being deposited on the measuring elements in such a manner, that regions of the measuring elements are situated between each region of the contact-layer system and the diaphragm layer. This is used to provide, in particular, a high-pressure sensor, in which the capacitances of the contacts of the contact-layer system are designed to be symmetric.

Abstract: A composite profiled section consisting of a base profiled section (1) made of a good electro-conductive material and at least one surface layer that is joined to the base profiled section (1) and is made of a material, such as a metal anti-wear strip (19), with a high resistance to abrasion. At least one of the longitudinal edges of the anti-wear strip (19) should contain recesses (27), notches (77, 78) or compressions (82) that are at least partially filled with a connecting substance (59) or a connecting profile (11, 39, 66, 69, 74) for connection to the base profiled section (1) in a positive or non-positive fit.

Abstract: A method for registering a plurality of substrates that are retained on a workpiece carrier onto an exposure mask for carrying out a photolithography process has the steps of registering and immobilizing the exposure mask onto an alignment panel having precisely fitting passthrough orifices for reception of one substrate for each passthrough orifice and inserting into the passthrough orifices of the alignment panel the substrates that are retained on the workpiece carrier.

Abstract: A method for manufacturing a sensor component, in particular, a thin-film high-pressure sensor, as well as a sensor component, is described, in which at least one measuring element, in particular an expansion measuring strip is arranged on a membrane, and separated from the membrane through an electrically insulating film, the measuring element being arranged on an electrically insulating substrate, which is mounted in a subsequent step onto the membrane on the side that faces away from the measuring element, so that the electrically insulating substrate forms the electrically insulating film. The electrically insulating substrate performs both a carrier function during the application of the expansion measuring strip to the substrate as well as an insulation function after the mounting of the substrate onto the membrane. In this way, the application of a separate insulation film made of silicon dioxide becomes unnecessary.

Abstract: Proposed is a method for manufacturing a thin-layer component, in particular a thin-layer, high-pressure sensor, as well as a thin-layer component, where a resistive layer for forming measuring elements, in particular strain gauges (30), is deposited on an electrically non-conductive surface of a diaphragm layer (10, 20), a contact-layer system (41) for electrically contacting the measuring elements being deposited on the measuring elements in such a manner, that regions of the measuring elements (30) are situated between each region of the contact-layer system and the diaphragm layer (10, 20). This is used to provide, in particular, a high-pressure sensor, in which the capacitances of the contacts of the contact-layer system are designed to be symmetric.

Abstract: A method for manufacturing a sensor component, in particular, a thin-film high-pressure sensor, as well as a sensor component, is described, in which at least one measuring element, in particular an expansion measuring strip is arranged on a membrane, and separated from the membrane through an electrically insulating film, the measuring element being arranged on an electrically insulating substrate, which is mounted in a subsequent step onto the membrane on the side that faces away from the measuring element, so that the electrically insulating substrate forms the electrically insulating film. The electrically insulating substrate performs both a carrier function during the application of the expansion measuring strip to the substrate as well as an insulation function after the mounting of the substrate onto the membrane. In this way, the application of a separate insulation film made of silicon dioxide becomes unnecessary.

Abstract: Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section. The cooling fins are in the form of a cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.

Abstract: A composite section features a base of light-weight metallic material as section component and at least one further profiled section component, in particular a profiled strip of another metallic material which is joined metallically as a surface layer to the base section during an extrusion process. Projecting out of the inner-lying face of the profiled strip and directed at the base is at least one projection and/or an additional element which are/is embedded in the base. Each additional element may delimit an undercut space which is filled in an interlocking manner by metallic material of the base.

Abstract: A composite section (10) features a base (12) of light-weight metallic material as section component and at least one further profiled section component, in particular a profiled strip (18) of another metallic material which is joined metallically as a surface layer to the base section during an extrusion process. Projecting out of the inner-lying face (21) of the profiled strip (18) and directed at the base (12) is at least one projection and/or an additional element (23) which are/is embedded in the base (12). Each additional element (23) may delimit an undercut space which is filled in an interlocking manner by metallic material of the base (12).

Abstract: Heat exchanger for cooling semi-conductor components or the like equipment features cooling fins that are spaced apart, attached to and project out from a base section of extruded aluminum or another light metal, each fin being secured in a groove or the like recess in the base section,The cooling fins are in the form of cooling-fin plates made of thin-gauge strips of material and, as viewed in longitudinal cross-section, are profiled at least in the region where they join the base section.

Abstract: A composite section (10) features a base (12) of light-weight metallic material as section component and at least one further profiled section component, in particular a profiled strip (18) of another metallic material which is joined metallically as a surface layer to the base section during an extrusion process. Projecting out of the inner-lying face (21) of the profiled strip (18) and directed at the base (12) is at least one projection and/or an additional element (23) which are/is embedded in the base (12). Each additional element (23) may delimit an undercut space which is filled in an interlocking manner by metallic material of the base (12).

Abstract: In a system comprising at least two conductor rails, in particular composite sections each featuring a rail-shaped load-bearing section and at least one strip-shaped section of another metal of greater wear resistance joined to the matrix of the load-bearing section, the ends of pairs of neighbouring rails are connected electrically by at least one conductor of variable length. The ends of the conductor rails are bent out of the central axis (M) of the conductor rail and led parallel to and a distance (n) displaced from that axis, such that the strip-shaped section of one conductor rail end is approximately aligned with the strip-shaped section of the other conductor rail away from the rail end; the conductor rail ends are joined in such a manner that they can move with respect to each other along the axial direction.

Abstract: The process for making a matrix of thin layer transistors with memory capacitors includes forming a first conductive layer on a substrate, and in a first mask step, etching it to form row conductors of the matrix, gate contacts of the thin layer transistors and ground electrodes of the memory capacitors; forming a gate-insulating layer for the thin layer transistors; forming a semiconductor layer, especially an a-Si:H semiconductor layer; applying a p- or n-doped semiconductor layer to provide drain and source contacts; forming and etching a second conductive layer for the column conductors of the matrix of the thin layer transistors, the drain and source contacts of the thin layer transistors and the counter electrodes of the memory capacitors in a second mask step; plasma etching of the doped semiconductor layer with the second conductor layer acting as mask and determining an end of the etching process by observing the optical emission of an etching plasma used for the plasma etching; etching the undoped s