Abstract: The devices and methods of the art do not readily allow moistening of, removing gas bubbles from and/or increasing the transfer of material in through bores and/or pocket holes in printed circuit boards (PCB). Considerable problems are presented by the treatment of very narrow bores with high aspect ratios in particular. To overcome this problem a method was found that involves the following stages: the printed circuit boards PCB are passed through a processing plant on a horizontal conveying path and in one conveying plane 2 by means of transportation means 13, 14 and are thereby brought to contact a liquid for treatment, wherein mechanical pulses are directly transmitted to the printed circuit boards PCB via the transportation means 13, 14 and/or via the liquid for treatment by means of pulse generating means 50.

Abstract: The devices and methods of the art do not readily allow moistening of, removing gas bubbles from and/or increasing the transfer of material in through bores and/or pocket holes in printed circuit boards (PCB). Considerable problems are presented by the treatment of very narrow bores with high aspect ratios in particular. To overcome this problem a method was found that involves the following stages: the printed circuit boards PCB are passed through a processing plant on a horizontal conveying path and in one conveying plane 2 by means of transportation means 13, 14 and are thereby brought to contact a liquid for treatment, wherein mechanical pulses are directly transmitted to the printed circuit boards PCB via the transportation means 13, 14 and/or via the liquid for treatment by means of pulse generating means 50.

Abstract: An aqueous solution for etching and activating a surface of a nonconductive substrate for subsequent chemical and, if necessary, electrochemical deposition of a metal coating containing both an activator and an etching agent. The activator is a salt or complex compound containing a metal selected from group Ib or group VIII of the periodic table. The etching agent is manganate or permanganate ion. This solution can be used in a shortened process for metallizing isolated surfaces, especially as a part of a process for making electrical connecting elements and circuit boards.

Abstract: A method of and an apparatus for etching an epoxy resin having a high backetching rate, in particular bores with printed circuit boards, with stable, strong, basic alkaline permanganate etching solution wherein the solution is stablized by electrochemical anodal oxidation, and permanganate and OH-ion concentration is controlled by measuring the same by using electrochemical and/or photometric measuring method with subsequent metering of the solution in accordance with deviation of a measurement value from a nominal value.

Abstract: A conditioning agent is disclosed, for the pre-treatment of base materials for subsequent complete and uniform chemical metallization, characterized by a content of a quaternary organic nitrogen compound. Also disclosed is a process for the pre-treatment of base materials, employing said conditioning agent. Preferred embodiments include as active agent at least one compound of the general formula ##STR1## represents a cyclical nitrogen compound, R is hydrogen, C.sub.1 -C.sub.4 -alkyl or hydroxy-C.sub.1 -C.sub.2 -alkyl,n is 0 or 1, andX.sup.(-) is the anion of an inorganic or an organic acid.

Abstract: A conditioning agent is disclosed, for the pre-treatment of base materials for subsequent complete and uniform chemical metallization, characterized by a content of a quaternary organic nitrogen compound. Also disclosed is a process for the pre-treatment of base materials, employing said conditioning agent. Preferred embodiments include as active agent at least one compound of the general formula ##STR1## represents a cyclical nitrogen compound, R is hydrogen, C.sub.1 -C.sub.4 -alkyl or hydroxy-C.sub.1 -C.sub.2 -alkyl,n is 0 or 1, andx.sup.(-) is the anion of an inorganic or an organic acid.

Abstract: A process for the adhesive metallization of polyimide through pretreating of the polyimide and subsequent activation, as well as chemical metallization, if necessary, followed by galvanic metal deposition, characterized in that the polyimide is pretreated with an aqueous solution of alkali hydroxide and an organic nitrogen compound such as one selected from the group consisting of N,N,N', N'-tetra-(2-hydroxypropyl)-ethylenediamine, ethylenediaminetetraacetic acid and nitrilotriacetic acid. The plastics metallized according to the present invention find use as shaped parts, preferably in the fields of electrical engineering and electronics.