Abstract: The invention relates to a method for producing chip cards having electronic modules. The prior art discloses different production methods for such chip cards wherein the particular electronic module used has a special structure. In contrast, a method is now presented for producing chip cards having electronic modules that uses a standardized electronic module which is adapted to the production technique for the card in a last method step and connected with the card body by the selected technique.

Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.

Abstract: The invention relates to a method and an apparatus for applying flat punched elements in the desired position to the surface of a carrier material, the elements being present in multiple copies on a sheet. The multiple copies are fed to an applying device and positioned therein. At the same time as individual elements are separated out or punched, these elements are fixed in position with respect to the carrier material.

Abstract: An identity card, e.g. a check card or credit card, usually has a field in which the card user writes has signature when the card is handed over. A weakness that manipulators of the cards could exploit up to now was that the signature field could be detached and replaced by an imitated signature field. To make such manipulation easily recognizable and thus impede forgery, the invention proposes making the security print (guilloche print), that covers the surroundings of the signature field anyway, extend without interruption across the signature field as well. Whereas it is already extremely difficult to imitate a signature field provided with such a security print, it is virtually impossible to dispose the security print in such a way that is passes continuously from the signature field into the surroundings of the signature field (FIG. 1).

Abstract: A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Abstract: A method of making a laminated multi-layer data carrier includes laminating a core layer, an intermediate substrate carrying an IC module, electrical contact pads, and electrical leads connecting the IC module to the contact pads, and a cover layer having contact apertures therein together under heat and pressure so that the IC module is pressed into the core layer and protected within the central core of the carrier while the contact pads are pressed outwardly into the apertures of the cover layer so that the contact pads are flush with the surface of the cover layer. Alternative embodiments are described wherein the core layer supports the contact pads in the apertures of the cover layer and where the laminating process is carried out such that the substrate is anchored between the core and cover layers.

Abstract: In order to simplify the production of an identification card having a colored magnetic track, it is proposed that the magnetic track located on the laminating or transfer band be masked by a white layer of color. By applying the white masked magnetic track to a white colored card layer or to a transparent layer to be underlaid with a white colored layer, one produces a completely user-neutral semifinished product. This iniformly designed semifinished product can then be provided on one or both sides with the particular printed pattern desired as one chooses. the design being selected without any separate consideration of the stripe area.

Abstract: A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging form liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Abstract: A carrier element suitable for production in large numbers, e.g. for incorporation in identification cards, having an integrated circuit and the connection leads and contacts necessary for the operation of the circuit. The carrier consists of a single or multilayer insulating material, e.g. a film, carrying the circuit contacted with the connection leads in punched out windows. To protect the circuit from mechanical stress the thickness of the film is greater than or at least equal to the thickness of the integrated circuit plus the thickness of the contacted connection leads.

Abstract: A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

Abstract: A multilayer data carrier into which a carrier element supporting an IC module is incorporated comprises a flexible substrate on which contact surfaces are formed which are connected to the IC module via leads. The carrier element is deformed in such a way, when being incorporated into the data carrier, that the IC module, in the finished data carrier, is located in the center of the card protected by cover layers of the card and the contact surfaces are flush with the surface of the card. A method for producing the data carrier comprises laminating a substrate layer carrying an IC-module with its leads and contact pad surfaces on one surface thereof between outer protective layers and with a central core layer such that the IC-module is disposed centrally within the data carrier with the contact surfaces disposed in apertures in one of the outer protective layers flush with the surface of said one layer.

Abstract: A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Abstract: A carrier element for an IC-module for incorporation into an identification card. The element includes a flexible carrier film supporting conductive leads and contact pads. A semi-conductor chip is electrically connected to the leads and pads. Cast resin surrounds the chip and carrier film, including the carrier pads, to form a solid carrier element capable of resisting mechanical stresses.

Abstract: The integrated circuit embedded in a data carrier and the contact surfaces connected with this circuit are to be protected against bending of the data carrier. For this purpose, the data carrier is divided into two areas, the first one, which bears the circuit and is generally small compared to the second area, being connected to the second area via a predetermined breaking point. Stress which occurs when the data carrier is bent is kept away from the circuit, or transmitted only weakly to it, by the predetermined breaking point.

Abstract: An identification card equipped with an integrated circuit, in which the circuit along with its connection leads is arranged on a carrier element which is embeddedly enclosed by the card on all sides by use of the hot lamination technique. In order to protect the sensitive arrangement, the carrier element is subjected to the full laminating pressure only when one or more layers in the card construction have softened.This is achieved, for example, by providing buffer zones in the card laminate at least in the area of the arrangement in the form of cavities or layers that are easy to deform elastically. The buffer zones protect the arrangement from local pressure peaks in the initial phase of the laminating process. It is also possible to control the laminating pressure as a function of the temperature or the degree of softening of the card layers.

Abstract: A carrier element for an IC module for incorporation into data carriers, in which the IC module is connectd with contact surfaces by means of leads, and the contact surfaces are designed for direct contacting.In order to protect the Integrated Circuit against destruction due to static charges, measures are provided to dissipate outside the circuit any portions of charge that may occur. In one embodiment, all terminals of the circuit have a low resistance connection with each other. The connection is suspended during each operational phase and is then restored. In a further embodiment, the terminals are bridged by spark gaps. This protective step is advantageous in that it is not necessary to remove and then restore the bridging.

Abstract: A multilayer identification card is equipped with an IC module. The module is arranged on a carrier element which is located in a recess in the multilayer card. The card layers bordering the recess bear supporting layers which are thermoresistant in the range of hot lamination temperatures. This prevents the recess from becoming filled with fluid card material during the hot laminating process, during which the card layers will soften and eventually become fluid. Thus, the IC module can advantageously give way within the recess when the card is bent. Further, the supporting layers have a stabilizing effect on the adjacent card layers and thereby prevent irregularities caused by incorporation of the carrier element from being passed onto the card surface.

Abstract: An identification card having an IC module for the processing of electrical signals. The IC module (9) and the leads (6) and contact surfaces (5, 20) necessary for the operation of the module are attached to a separate carrier (7, 17) and embedded in the identification card in such a way that the IC module is located in an area (4) of the card having the maximally permitted thickness, whereas the contact surfaces are arranged outside this area. The placement of the IC module in the elevated card area (e.g. the impressing area) allows for a thicker encapsulation of the module and correspondingly better protection against mechanical stress. On the other hand, the area of the carrier element with the contact surfaces is arranged outside the elevated area of the card, for example in the magnetic stripe area (2).

Abstract: A method and apparatus for conducting logging or perforating operation in a borehole, particularly a deviated borehole, includes lowering a length of drill pipe having the well-logging tool, or well bore perforator, releasably mounted thereon into the borehole. An extension member, which is also lowered through the drill pipe, is secured to the well-logging tool, or well bore perforator, and releases it from the drill pipe, whereupon the extension member and well-logging tool or well bore perforator are moved through the borehole. The apparatus includes a latching sub mounted to the end of the length of drill pipe, and a latching head releasably mounted within the latching sub for releasably holding a well-logging tool or well bore perforator within the latching sub.

Abstract: A method and apparatus for sealing a well casing, when a length of production tubing is disposed within the well casing, utilizes a sealing means having a first diameter less than the diameter of the production tubing, and the sealing means is compressible to a second diameter which sealingly conforms to the diameter of the well casing, to prevent fluids disposed in the well casing below the sealing means from flowing through the well casing to above the sealing means. .Iadd.To support the sealing means when it has been sealingly conformed to the diameter of the well casing, the well bore apparatus of the invention further includes upper and lower sets of opposed reinforcing members which are mounted on the body of the well bore apparatus above and below the sealing means and operatively arranged to be respectively swung outwardly from the body to an extended position for supporting the upper and lower end portions of the sealing means against longitudinal movement in the well casing. .Iaddend.