Abstract: A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20° C. to 50° C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.

Abstract: A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20° C. to 50° C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.

Abstract: A device for spreading a multi-stranded tensioning cable, in particular steel tensioning cables, comprising a main body having a feedthrough opening for the entire tensioning cable, and a number of spreading elements which are arranged radially movably in the main body and each have a contour which is of a configuration tapering inwardly in the radial direction for engaging and producing a gap between respectively adjacent strands of the tensioning cable.

Abstract: A treatment container (1) for accommodating an ophthalmic lens (2) comprises a bottom (3), a side wall (4) surrounding the bottom (3) and together with the bottom (3) forming a cavity (5) for accommodating the ophthalmic lens, a container opening (6) arranged opposite to the bottom (3), and a fluid opening (7) arranged in the bottom (3) or in the side wall (4) of the treatment container (1). The fluid opening (7) is in fluid communication with the cavity (5). The treatment container (1) further comprises a fluid conveyance channel (8) and a supply connector (9). The fluid conveyance channel (8) is connected to the fluid opening (7) so as to be in fluid communication with the fluid opening (7).

Abstract: A device for spreading a multi-stranded tensioning cable, in particular steel tensioning cables, comprising a main body having a feedthrough opening for the entire tensioning cable, and a number of spreading elements which are arranged radially movably in the main body and each have a contour which is of a configuration tapering inwardly in the radial direction for engaging and producing a gap between respectively adjacent strands of the tensioning cable.

Abstract: Wire spools used for multiple wire saws for slicing one or more wafers from a workpiece composed of semiconductor material using a wire web including parallel wire sections coated with bonded abrasive grain. The wire spools include a first wire spool configured as a dispensing spool and a second wire spool configured as a receiver spool. A sawing wire coated with bonded abrasive grain runs from the first wire spool via at least one deflection roll to the wire web and from the wire web via at least one deflection roll to the second wire spool. The sawing wire enters into guide grooves of the deflection rolls at an alignment angle ?1 and exits the guide grooves of the deflection rolls at an alignment angle ?2. The sawing wire has a single layer winding on each of the first and second wire spools.

Abstract: Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.

Abstract: The invention relates to a multilayered, opaque, biaxially oriented polyolefin film having a thickness of at least 30 ?m consisting of a vacuole-containing base layer and intermediate layers applied to both sides thereof, and cover layers applied to either side of the intermediate layers. Both intermediate layers have a thickness of at least 3 ?m and contain at least 70% by weight of a propylene homopolymer. Both cover layers are constructed from incompatible polymers. The inner cover layer has a surface roughness Rz of at least 3.0 ?m and the outer cover layer has a roughness from 1 to 3 ?m, the roughness of the inner cover layer being at least 1.5 units greater than the roughness of the outer cover layer.

Abstract: The invention relates to an irradiation unit for the UV irradiation of particularly web-shaped substrates, comprising a housing (10), a tubular UV lamp (12), arranged therein and a reflector arrangement (14), running along the UV lamp (12). According to the invention, a simple exchangeability may be achieved, whereby the reflector arrangement comprises a support profile (22), retained in the housing (10) and a reflector profile (24), embodied as a shape-retaining molded piece which may be detachably connected thereto.

Abstract: The invention relates to a method for raising the surface tension of biaxially-stretched films made of thermoplastic polymers. According to the method, a film is first treated on a surface by means of an atmospheric pressure plasma before being stretched transversally or simultaneously across the width thereof, and the film is additional a subjected to a second treatment by means of a corona or flame after being stretched transversally or simultaneously, the second treatment being done on the same surface which has already been plasma-treated.

Abstract: Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.

Abstract: The invention relates to a device and a method for the corona treatment of flat material (30) using a cylindrical transport electrode (1) that can be rotated in such a way as to transport the flat material, a treatment electrode (2a,b) which is arranged opposite the transport electrode (1) and defines a treatment gap (31) for the flat material (30), a high-voltage source (4) for applying a high-frequency electrical voltage to the treatment electrode (2a, b), and sheet holders (11) which are arranged on the envelope side of the transport electrode (1) and used to receive the edges of sheets of flat materials (30). The inventive device is characterized by a treatment device (12) wherein blowing means (22, 23) are embodied or arranged in front of, and behind, at least one treatment electrode (2a, 2b), in the direction of transport (32).

Abstract: The invention relates to a method for manufacturing a multilayer biaxially oriented film which comprises at least five layers having the arrangement A/B/C/B/A, the inner layer C being synthesized from an ethylene-vinyl-alcohol copolymer (EVOH layer) and an adhesion promoting layer B made of modified polyolefin being applied on both sides on each surface of the EVOH layer C and a layer A made of a partially crystalline thermoplastic polyolefin being applied to the surfaces of the particular adhesion promoting layers, characterized in that the melts corresponding to the individual layers of the film are coextruded through a sheet die, the multilayer film thus obtained is drawn off on one or more roll(s) for solidification, the film is subsequently stretched in the longitudinal direction and then in the transverse direction using a tenter frame, the EVOH layer C and the adhesion promoting layers B and the layer A are coextruded at the same width, and the tenter hooks of the frame engage all five layers jointly a

Abstract: Correction of grinding spindle positions in double-side grinding machines for the simultaneous double-side machining of semiconductor wafers is achieved by torsionally coupling the two grinding spindles, each comprising a grinding disk flange for receiving a grinding disk, and providing a measuring unit with an inclinometer and two sensors for distance measurement, between the two grinding disk flanges such that the grinding spindles are essentially in the position they would have with mounted grinding disks during the grinding process, wherein the coupled grinding spindles are rotated while inclinometer and sensors determine radial and axial correction values of axial alignment to adjust the grinding spindles to a symmetrical orientation. The spindle positions may be corrected under the action of process forces.

Abstract: The invention relates to a metallized, biaxially oriented, transparent polypropylene multi-layer film which contains at least two layers, wherein the layers comprise a base layer and at least one first metallized cover layer on a surface of the base layer wherein the layer contains at least 80% by weight of a propylene-ethylene copolymer which has an ethylene content of 1.2 to <2.8% by weight and a propylene content of 97.2-98.8% by weight and a melting point in the region of 140 to 160° C. and a fusion enthalpy of 80 to 110 J/g and the first cover layer has a thickness of at least 2.5 ?m and the film is metallized on the surface of the first cover layer.

Abstract: Semiconductor wafers are processed so as to remove material on one or both sides by means of at least one grinding tool, with coolant supplied into a contact region between the semiconductor wafer and the at least one grinding tool, characterized in that the coolant flow rate is set as a function of a grinding tooth height of the at least one grinding tool and this coolant flow rate is reduced as the grinding tooth height decreases.

Abstract: The invention relates to a UV irradiation unit comprising a housing (10), a rod-shaped lamp (12) which is arranged therein, a reflector (14) which extends along the UV-lamp (12) and which defines a lamp chamber (22) which surrounds the UV-lamp (12), in addition to a channel system (20) for guiding a cooling coolant through the reflector (14). According to the invention, the channel system (20) is arranged on the outside of the lamp chamber (22) such that it remains void of the coolant flow (24) for operating the lamp in an optimum manner.

Abstract: The invention relates to an irradiation unit for the UV irradiation of particularly web-shaped substrates, comprising a housing (10), a tubular UV lamp (12), arranged therein and a reflector arrangement (14), running along the UV lamp (12). According to the invention, a simple exchangeability may be achieved, whereby the reflector arrangement comprises a support profile (22), retained in the housing (10) and a reflector profile (24), embodied as a shape-retaining molded piece which may be detachably connected thereto.

Abstract: The invention relates to a method for raising the surface tension of biaxially-stretched films made of thermoplastic polymers. According to the method, a film is first treated on a surface by means of an atmospheric pressure plasma before being stretched transversally or simultaneously across the width thereof, and the film is additional a subjected to a second treatment by means of a corona or flame after being stretched transversally or simultaneously, the second treatment being done on the same surface which has already been plasma-treated.

Abstract: The invention relates to the use of a polyolefinic film, with at least one layer, which is made from polyolefinic polymers, whereby said polyolefinic film comprises a bonding layer as outer layer. Said bonding layer contains at least 50 wt. % based on the weight of the layer of a maleic anhydride modified polyolefin. The film is used for printing, metallising or coating.