Patents by Inventor Joachim Runck

Joachim Runck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9846135
    Abstract: A moisture sensor arrangement including a plate-like semiconductor substrate and an integrated signal processing component disposed on a first side of the semiconductor substrate. The moisture sensor arrangement including a capacitive moisture sensor connected electrically conductively to the integrated signal processing component, wherein the capacitive moisture sensor is disposed on either the first side or a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate. In addition, the plate-like semiconductor substrate includes 1) plated through-holes, by way of which elements on the first side and the second side of the semiconductor substrate are electrically connectable to one another; and 2) a temperature sensor integrated with the integrated signal processing component.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: December 19, 2017
    Assignee: E+E ELEKTRONIK GES.M.B.H
    Inventors: Elmar Mayer, Georg Niessner, Joachim Runck
  • Publication number: 20130287062
    Abstract: A moisture sensor arrangement including a plate-like semiconductor substrate and an integrated signal processing component disposed on a first side of the semiconductor substrate. The moisture sensor arrangement including a capacitive moisture sensor connected electrically conductively to the integrated signal processing component, wherein the capacitive moisture sensor is disposed on either the first side or a second side of the semiconductor substrate that is opposite the first side of the semiconductor substrate. In addition, the plate-like semiconductor substrate includes 1) plated through-holes, by way of which elements on the first side and the second side of the semiconductor substrate are electrically connectable to one another; and 2) a temperature sensor integrated with the integrated signal processing component.
    Type: Application
    Filed: April 23, 2013
    Publication date: October 31, 2013
    Applicant: E+E Elektronik Ges.m.b.H
    Inventors: Elmar Mayer, Georg Niessner, Joachim Runck