Abstract: In a module base unit (1) for a module (30) for a data carrier, two connection plates (2, 3) are provided, which comprise electrically conductive material and which each have a direction of extent (4, 5) and which are separated from each other by a gap (16) transverse to the two directions of extent (4, 5), and at least one strain relief member (34) is connected to the two connection plates (2, 3), which strain relief member (34) is constructed to absorb tensile forces occurring parallel to the directions of extent (4, 5) and acting on the connection plates (2, 3).

Abstract: In the case of a module (1) for a data carrier (11) designed for contactless communication, the module (1) has a chip (3) with at least two pairs (20, 21) of chip connection contacts (4, 5, 6, 7) and with at least two pairs (22, 23) of module connecting plates (24, 25, 26, 27), wherein in a starting position, the shapes of the plate surfaces of the module connecting plates (24, 25, 26, 27) result in a particular plate pattern, and differ with regard to the shape of the plate surfaces such that when all the module connecting plates (24, 25, 26, 27) are rotated around a mid-point (8) of the module (1), the same plate pattern results respectively after 180°.

Abstract: A module (1) for a data carrier (3) for performing of operations with contacts and operations without contacts comprising an integrated component (4) with component connections (A1, A2, A3, A4, A5, A7, A8) and having a contact field (5) accessible to counter contacts with module connecting contacts (C1, C2, C3, C4, C5, C6, C7, C8), with each component connection (A1, A2, A3, A5, A7) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C1, C2, C3, C5, C7) of the contact field (5) and each component connection (A4, A8) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C4, C8) of the contact field (5).

Abstract: In a data carrier (1) with a chip module (3), the chip (5) of the chip module (3) is provided, in the region of its chip connecting layers (8), with a respective wire connecting means which is formed by a flat metal layer (10) and whereto an end (13), bonded in a wedge-shape fashion, of a bond wire (11) is connected.

Abstract: A method and device is disclosed for determining deviations of a nominally planar surface of a thin object, which is subject to warpage related to gravity, such as a wafer, relative to a reference plane. The method includes supporting the object by three support members and detecting deviations, wherein the three support members are in a position relative to each other so that each support member is located underneath the point of gravity of a circular sector of the object extending over an angular range of 120°.

Abstract: A module (1) for a data carrier (3) for performing of operations with contacts and operations without contacts comprising an integrated component (4) with component connections (A1, A2, A3, A4, A5, A7, A8) and having a contact field (5) accessible to counter contacts with module connecting contacts (C1, C2, C3, C4, C5, C6, C7, C8), with each component connection (A1, A2, A3, A5, A7) used for operations with contacts being in an electrically conductive connection with a module connecting contact (C1, C2, C3, C5, C7) of the contact field (5) and each component connection (A4, A8) used for operations without contacts also being in an electrically conductive connection with a module connecting contact (C4, C8) of the contact field (5).

Abstract: In a data carrier (1) with a chip module (3), the chip (5) of the chip module (3) is provided, in the region of its chip connecting layers (8), with a respective wire connecting means which is formed by a flat metal layer (10) and whereto an end (13), bonded in a wedge-shape fashion, of a bond wire (11) is connected.

Abstract: The transmission coil (11) in a device (1) which includes a data carrier module (3) with a holding (4) and an integrated circuit (6) which is supported by the holding (4) and includes a transmission coil (11) which is electrically conductively connected to the integrated circuit (6) and to the holding (4), is covered, except for the area of its two coil connection contacts (13, 14), by a protective layer (16) of an electrically insulating material, a connection wire being provided between each coil connection contact (13, 14) and an associated circuit connection contact (7, 8), the integrated circuit (6) and the two connection wires (19, 20) and the areas of the two coil connection contacts (13, 14) which are not covered by the protective layer (16) being protectively covered by a single protective cap (10).