Abstract: An apparatus for the placement of a semiconductor chip on a substrate is provided.

Abstract: The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.

Abstract: In a method and in an apparatus for the placement of electronic components (1) onto a substrate (2) at a placement station (3), the component bearing by a bearing side (4) at a supply station is picked up by means of a primary tool (6) and is transported away by means of a rotational movement and is transferred to at least one pivoting tool (41, 42). In this case, the path of the component between the plane (47) of the supply station and a provision plane (7) located at a higher level is covered in at least two separate curve movements. In the provision plane, the component is accepted by at least one secondary tool, is transported over the substrate and is deposited there. Depending on whether the primary tool transfers the component first to an intermediate pivoting tool (41) or directly to a final pivoting tool (42), the component can be placed onto the substrate once again by the same bearing side or else by its structure side.

Abstract: The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.