Abstract: A semiconductor device is provided that includes a first n+ region, a first p+ region within the first n+ region, a second n+ region, a second p+ region, positioned between the first n+ region and the second n+ region. The first n+ region, the second n+ region and the second p+ region are positioned within a p? region. A first space charge region and a second space charge region are formed within the p? region. The first space region is positioned between the first n+ region and the second p+ region, and the second space region is positioned between the second p+ region and the second n+ region.

Abstract: This disclosure relates to a semiconductor device including a device with high clamping voltage (HVC device), and an OTS device. Such a semiconductor device provides very advantageous ESD protection. The semiconductor device can be realized in two ways: an OTS device and a device with high clamping voltage can be realized as discrete, independent devices that are combined in one semiconductor package, or an OTS device can be integrated into interconnect layers of a device with high clamping voltage by integration.

Abstract: A semiconductor device is provided that includes a first n+ region, a first p+ region within the first n+ region, a second n+ region, a second p+ region, positioned between the first n+ region and the second n+ region. The first n+ region, the second n+ region and the second p+ region are positioned within a p? region. A first space charge region and a second space charge region are formed within the p? region. The first space region is positioned between the first n+ region and the second p+ region, and the second space region is positioned between the second p+ region and the second n+ region.

Abstract: A semiconductor device and method of manufacturing a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a semiconductor layer located on the substrate; at least one shallow trench and at least one deep trench. Each of the at least one shallow trench and the at least one deep trench extending from a first major surface of the semiconductor layer. Sidewall regions and base regions of the trenches comprise a doped trench region and the trenches are at least partially filled with a conductive material contacting the doped region. The shallow trenches terminate in the semiconductor layer and the deep trench terminates in the semiconductor substrate.

Abstract: A semiconductor device and a method of making the same. The device includes a substrate comprising a major surface and a backside. The device also includes a dielectric partition for electrically isolating a first part of the substrate from a second part of the substrate. The dielectric partition extends through the substrate from the major surface to the backside.

Abstract: A semiconductor device and method of manufacturing a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a semiconductor layer located on the substrate; at least one shallow trench and at least one deep trench. Each of the at least one shallow trench and the at least one deep trench extending from a first major surface of the semiconductor layer. Sidewall regions and base regions of the trenches comprise a doped trench region and the trenches are at least partially filled with a conductive material contacting the doped region. The shallow trenches terminate in the semiconductor layer and the deep trench terminates in the semiconductor substrate.

Abstract: A semiconductor device and a method of making the same. The device includes a substrate comprising a major surface and a backside. The device also includes a dielectric partition for electrically isolating a first part of the substrate from a second part of the substrate. The dielectric partition extends through the substrate from the major surface to the backside.

Abstract: A semiconductor device and a method of making the same. The device includes a substrate comprising a major surface and a backside. The device also includes a dielectric partition for electrically isolating a first part of the substrate from a second part of the substrate. The dielectric partition extends through the substrate from the major surface to the backside.

Abstract: A low-pass filter comprising: a filter input terminal; a filter output terminal; a filter FET configured to provide a resistance between the filter input terminal and the filter output terminal; a filter capacitor connected between the filter output terminal and a reference terminal; a bias FET configured to provide a bias voltage to the filter FET; a buffer connected between the filter input terminal and the bias FET, the buffer configured to source a bias current for the bias FET; and an offset voltage source configured to contribute to the bias voltage provided to the filter FET.

Abstract: A low-pass filter comprising: a filter input terminal; a filter output terminal; a filter FET configured to provide a resistance between the filter input terminal and the filter output terminal; a filter capacitor connected between the filter output terminal and a reference terminal; a bias FET configured to provide a bias voltage to the filter FET; a buffer connected between the filter input terminal and the bias FET, the buffer configured to source a bias current for the bias FET; and an offset voltage source configured to contribute to the bias voltage provided to the filter FET.

Abstract: A circuit arrangement for supplying a constant current which is stabilized against temperature variations. The constant current is produced by a current source which is controlled by a control stage in which a first control current is supplied to each of a first and a second resistor, at least one of which is trimmable. The first control current is controlled so that the difference between the voltages produced thereby across the first and second resistors is in a first predetermined ratio to the constant voltage produced by a reference voltage source. The current source is controlled by the control stage so that the constant current produced thereby is in a second predetermined ratio to the first control currents.