Patents by Inventor Joachim Voelter

Joachim Voelter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package and chip assembly
    Patent number: 9530754
    Abstract: A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: December 27, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher
  • CHIP PACKAGE AND CHIP ASSEMBLY
    Publication number: 20160035700
    Abstract: A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
    Type: Application
    Filed: October 12, 2015
    Publication date: February 4, 2016
    Inventors: Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher
  • Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly
    Patent number: 9159701
    Abstract: A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first side and a second side opposite the first side, with its second side to an electrically conductive carrier. An insulating layer is formed over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip. At least one second chip is arranged over the insulating layer. An encapsulating material is formed over the first chip and the second chip. Electrical contacts are formed through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: October 13, 2015
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher
  • METHOD OF MANUFACTURING A CHIP PACKAGE, CHIP PACKAGE, METHOD OF MANUFACTURING A CHIP ASSEMBLY AND CHIP ASSEMBLY
    Publication number: 20150076672
    Abstract: A method of manufacturing a chip package is provided. The method may include electrically contacting at least one first chip, the first chip including a first side and a second side opposite the first side, with its second side to an electrically conductive carrier. An insulating layer is formed over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip. At least one second chip is arranged over the insulating layer. An encapsulating material is formed over the first chip and the second chip. Electrical contacts are formed through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 19, 2015
    Applicant: Infineon Technologies AG
    Inventors: Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher