Abstract: A method for improving a chemical production process, wherein a derivative chemical product is produced through a derivative chemical production process based on at least some derivative process parameters at a chemical production facility, in which the chemical production facility comprises a facility intranet, wherein at least some derivative process parameters are measured from the derivative chemical production process by a production sensor computer system within the facility intranet and wherein a process model for simulating the derivative chemical production process is recorded in a process model management computer system outside the facility intranet. The invention also relates to a corresponding system for a chemical production process.

Abstract: A computer-implemented method for advisor recipe development is disclosed. According to the method, a processor receives a first component and identifies enhanced context specific information based on the selection of the first component. The context specific information is updated interactively when adding a second component, and/or additional components, to the first component. The context specific information may include text, tables, or charts and combinations thereof.

Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.

Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.

Abstract: The present invention provides a light-emitting diode (LED) lamp (100, 100a, 100b, 100c). The LED lamp (100, 100a, etc.) comprises a plug (110, 110a, 110b) having two contacts for electrical connections to two respective electric power supply conductors, a fixture (120, 120a, 120b, 120c, 120d) connected to the plug and a plurality of LEDs (11) mounted onto the fixture (120, 120a, etc.), so that heat is conducted directly away from the LEDs (11) through the fixture and plug. When the LED lamp is connected to a lamp holder (20) and electric power is supplied from the power supply conductors, heat generated from operation of the LEDs (11) is conducted away through the fixture, plug and power supply conductors to the ambience.

Abstract: The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its bottom surface. The top lead frame is coupled to the bottom lead frame by an isolation layer, wherein the isolation layer is a thermal conductive, but electrical isolative, material. The power semiconductor package further comprises a power semiconductor device coupled to the top lead frame of the dual lead frame assembly and an encapsulation member encapsulating the dual lead frame assembly and the power semiconductor device, while exposing the first heat sink pad at the bottom surface of the bottom lead frame.

Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.

Abstract: The incandescent lamp, which uses a carbon cycle process, is equipped with a luminous body which, together with a fill, is introduced in a vacuum-tight manner into a bulb, the luminous body including a metal carbide, the melting point of which is above that of tungsten. The distance between the luminous body and the wall of the bulb is less than 18 mm, with a first cycle process, which is attributed to the carbon, being effected by the use of carbon and hydrogen as fill additive, and a second cycle process, which is attributed to the metal, being effected by the use of halogen.

Abstract: A device for producing rigid plastic pipes of an approximately cylindrical shape, contains an extruder and a calibrating station following in the direction of production, which has calibrating tools to calibrate the outside diameter of the already partly hardened pipe. The calibrating tools bear against the outside wall of the pipe, lamellae serving as calibrating tools being respectively connected to spindles, which, for adaptation to different outside diameters of pipes that are to be calibrated, being adjustable in a radial direction perpendicular to the axis of the calibrating device and feed axis of the pipe that is to be extruded.

Abstract: An ultraviolet super-continuum source with a fiber-optic may be provided with direct stimulation by a laser having a relatively narrow bandwidth, for example, less than the typical Raman shift in the material of the optical fiber to provide a super-continuum source extending for wavelengths below 400 nanometers.

Abstract: The incandescent lamp, which uses a carbon cycle process, is equipped with a luminous body which, together with a fill, is introduced in a vacuum-tight manner into a bulb, the luminous body including a metal carbide, the melting point of which is above that of tungsten. The distance between the luminous body and the wall of the bulb is less than 18 mm, with a first cycle process, which is attributed to the carbon, being effected by the use of carbon and hydrogen as fill additive, and a second cycle process, which is attributed to the metal, being effected by the use of halogen.

Abstract: A device for producing rigid plastic pipes of an approximately cylindrical shape, contains an extruder and a calibrating station following in the direction of production, which has calibrating tools to calibrate the outside diameter of the already partly hardened pipe. The calibrating tools bear against the outside wall of the pipe, lamellae serving as calibrating tools being respectively connected to spindles, which, for adaptation to different outside diameters of pipes that are to be calibrated, being adjustable in a radial direction perpendicular to the axis of the calibrating device and feed axis of the pipe that is to be extruded.

Abstract: This invention relates to novel polyisocyanate compositions, to a process for these polyisocyanate compositions, to a process for the production of cold cure flexible molded foams wherein this novel polyisocyanate composition comprises the polyisocyanate component, and to the cold cure flexible molded foams produced by this process.

Abstract: Azeotropic compositions made up of (a) from about 26 to about 72% by weight perfluorohexane and (b) one compound selected from (1) about 36 to about 74% by weight 2-methyl butane or (2) about 28 to about 53% by weight n-pentane in which the sum of the weight percent (a) and weight percent (b) is 100 percent may be used as blowing agents in the production of polyurethane/polyurea foams.

Abstract: Azeotropic compositions made up of (a) from about 4 to about 50% by weight 1,3-dioxolane and (b) one compound selected from (1) about 75 to about 96% by weight cyclopentane, (2) about 60 to about 79% by weight 2-methyl pentane, (3) about 59 to about 77% by weight 3-methyl pentane, and (4) about 50 to about 69% by weight n-hexane in which the sum of the weight percent of (a) plus weight percent of (b) is approximately 100 percent are used as blowing agents in the production of polyurethane/polyurea foams.

Abstract: Azeotropic compositions made up of from about 60 to about 78% by weight of 1,1,1,3,3-pentafluoropropane and from about 22 to about 40% by weight of tetramethylsilane have been found to be particularly useful as blowing agents for the production of polyurethane foams.

Abstract: Azeotropic compositions made up of from about 68.1 to about 69.1% by weight of dimethoxymethane, from about 29.7 to about 30.7% by weight of cyclopentane and from about 0.7 to about 1.7% by weight in which the sum of the weight percents of the components is 100% by weight. These azeotrope-like compositions are useful as blowing agents in the production of polyurethane foams.

Abstract: Azeotropic compositions made up of from about 60 to about 78% by weight of 1,1,1,3,3-pentafluoropropane and from about 22 to about 40% by weight of tetramethylsilane have been found to be particularly useful as blowing agents for the production of polyurethane foams.

Abstract: An azeotropic composition made up of from about 58 to about 77% by weight of dimethoxymethane and from about 23 to about 42% by weight of cyclopentane is used as a blowing agent in a process for the production of polyurethane foams.

Abstract: An azeotropic composition made up of from about 58 to about 77% by weight of dimethoxymethane and from about 23 to about 42% by weight of cyclopentane is used as a blowing agent in a process for the production of polyurethane foams.