Patents by Inventor Joachim WIESE

Joachim WIESE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER PASTE WITH OXALIC ACID AND AMINE COMPONENT
    Publication number: 20160311067
    Abstract: A solder paste for the mounting of electronic components and substrates contains a mixture of oxalic acid, adipic acid, and an amine component. An electronic component may be mounted on a substrate through the use of the solder paste. Also, a module may utilize the solder paste.
    Type: Application
    Filed: December 12, 2014
    Publication date: October 27, 2016
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Jens NACHREINER, Joachim WIESE, Sebastian FRITZSCHE
  • METHOD FOR MOUNTING A COMPONENT ON A SUBSTRATE
    Publication number: 20160316572
    Abstract: A method for mounting an electronic component on a substrate is provided. The method involves the use of a solder paste that includes a mixture of organic dicarboxylic acids. The thickness of the solder deposit is 25 to 200 ?m.
    Type: Application
    Filed: December 12, 2014
    Publication date: October 27, 2016
    Inventors: Jens NACHREINER, Joachim WIESE, Sebastian FRITZSCHE