Abstract: The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one aminoalkylimidazole compound, at least one diazabicycloalkylen compound and at least one latent hardener. In said epoxy-resin composition, the amount of the aminoalkylimidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm.

Abstract: The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm.

Abstract: The invention relates to multi-component epoxy resin compositions, comprising the following components: a) at least one epoxy resin component containing a1) at least one epoxy resin and a2) at least one compound of the general formula (I), wherein R1 and R2 independently from one another stand for hydrogen, C1-C6-alkyl, C1 -C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl, or C2-C6-alkynyl, or R1 and R2 jointly stand for a C3-C11 alkylene group; R3 and R4 independently from one another stand for hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl, or C2-C6-alkynyl, or R3 and R4 jointly stand for a C4-C6 alkylene group; b) at least one hardener component containing b1) at least one amine curing agent, wherein the epoxy resin component (a) and/or the hardener component (b) contain at least one additional constituent part c1), which is selected from aliphatic polyether polyols and aliphatic polyetheramine polyols.

Abstract: The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm.

Abstract: The invention relates to a process for preparing a conductive curable moulding compound with reduced electrical surface resistance, comprising mixing together an unsaturated polyester resin, a thermoplastic polymer, a conductive paste and optionally a filler, and is characterized in that the conductive paste is obtained by dispersing conductive pigment particles in a solution of a thermoplastic polymer in a suitable solvent. The invention further relates to the conductive paste itself and to mouldings having reduced surface resistance, obtained therefrom.

Abstract: Moldings having improved surface properties are produced using BMC molding materials which contain crystalline unsaturated polyesters.

Abstract: Stable, low-evaporation unsaturated polyester resins contain an ethylenically unsaturated polyester, styrene as comonomer, paraffins for preventing styrene evaporation and a pyrogenic silica with both hydrophilic and hydrophobic end groups.