Patents by Inventor Joan K. Vrtis

Joan K. Vrtis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coating for a heat dissipation device and a method of fabrication
    Publication number: 20040125563
    Abstract: Numerous embodiments of a coating for a heat dissipation device and a method of fabrication are disclosed.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventor: Joan K. Vrtis
  • Coated heat spreaders
    Patent number: 6751099
    Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: June 15, 2004
    Assignee: Intel Corporation
    Inventors: Joan K. Vrtis, Joni G. Hansen, Thomas J. Fitzgerald, Carl L. Deppisch
  • Coated heat spreaders
    Publication number: 20030117775
    Abstract: A coated heat spreader for a die includes a body and a coating on a surface of the body, wherein the outermost coating is an organic surface protectant. An IC package includes a die thermally coupled to a heat spreader coated with an organic surface protectant. A PCB assembly including a die thermally coupled to a heat spreader coated with an organic surface protectant, where the die is part of an IC package or is directly attached to the PCB. A method of making a coated heat spreader includes coating the organic surface protectant onto a surface of the heat spreader.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventors: Joan K. Vrtis, Joni G. Hansen, Thomas J. Fitzgerald, Carl L. Deppisch
  • Electronic package having embedded capacitors and method of fabrication therefor
    Patent number: 6407929
    Abstract: An electronic package (302, FIG. 3) includes one or more capacitors (308) embedded within one or more layers (310) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. 17-18) or ceramic capacitors. During the package build-up process, the capacitors are mounted (410, FIG. 4) to a package layer, and a non-conductive layer is applied (412) over the capacitors. When the build-up process is completed, the capacitor's terminals (604, 608, FIG. 6) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package (1904, FIG. 19), an interposer (1906), and/or a printed circuit board (1908).
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: June 18, 2002
    Assignee: Intel Corporation
    Inventors: Aaron Dean Hale, Michael Walk, David G. Figueroa, Joan K. Vrtis, Toshimi Kohmura