Patents by Inventor Joan V. Buot

Joan V. Buot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same
    Publication number: 20070132070
    Abstract: A chip package includes a microstrip spacer disposed between a first die and a second die. The microstrip spacer includes electrically conductive planes that are ground planes for at least one of the first die and the second die. A method includes operating the first die at a first clock speed and operating the second die at a second clock speed. A system includes a chip package with a microstrip spacer and a system housing.
    Type: Application
    Filed: December 9, 2005
    Publication date: June 14, 2007
    Inventors: Joan V. Buot, Christian Orias