Abstract: Package substrate with metallization layer(s) that includes an additional metal pad layer to facilitate reduced via size for reduced bump pitch, and related integrated circuit (IC) packages and fabrication methods. An additional metal pad(s) is provided in an insulating layer of a metallization layer(s) of the package substrate in which a via(s) is formed to reduce vertical connectivity distance between metal interconnects in adjacent metallization layers electrically coupled together by the via. This can reduce the aspect ratio and size of the via thereby allowing metal interconnects that are electrically coupled to the via to also be reduced in size (e.g., width) while still supporting an aligned, low resistance connection between the via(s) and the metal interconnects. Being able to reduce the size (e.g., width) of the metal interconnects can reduce bump pitch of the package substrate, which can facilitate a higher density of die/bump connections to the package substrate.

Abstract: Disclosed are devices in which a die, such as a system-on-chip (SoC) die is attached to an interposer with a mold. Unlike convention devices, the contact area for adhesion is increased by providing vertical surfaces in addition to lateral surfaces for attachment. In so doing, possibility of delamination is decreased significantly.

Abstract: The invention provides compositions and methods for treating diseases associated with expression of BCMA. The invention also relates to chimeric antigen receptor (CAR) specific to BCMA vectors encoding the same, and recombinant T cells comprising the BCMA CAR. The invention also includes methods of administering a genetically modified T cell expressing a CAR that comprises a BCMA binding domain.

Abstract: A dispensing device, having a hollow nipple-shaped stopper configured to act as a one-way valve, for use as a hair dyeing comb is provided. The nipple-shaped stopper has an aperture at its tip end. The aperture opens toward outside when the operator compresses the plastic bottle and closes when the operator releases the plastic bottle. When the aperture is in its closed position, the stopper prevents the liquid hair dye already in the conduit from flowing back to the plastic bag inside the bottle. The purpose of using the stopper here is to keep the air out of the dispensing system in order for the operator to pump the liquid dye efficiently. The stopper and a small aperture at the bottom of the plastic bottle are replacing the one-way valve currently used in many hair dye-dispensing devices. With interchangeable comb heads, the operator can choose the proper comb head for his hair type and different application purpose.

Abstract: The present invention discloses a device, which comprises a double burette syringe, a stopper, a slidable plate for mixing, and a plurality of mixing bars easily detachable from the mixing plate. This invention relates to devices for storing, delivering, and mixing of a two component double burette syringe.

Abstract: A dispensing device, having a hollow nipple-shaped stopper configured to act as a one-way valve, for use as a hair dyeing comb is provided. The nipple-shaped stopper has an aperture at its tip end. The aperture opens toward outside when the operator compresses the plastic bottle and closes when the operator releases the plastic bottle. When the aperture is in its closed position, the stopper prevents the liquid hair dye already in the conduit from flowing back to the plastic bag inside the bottle. The purpose of using the stopper here is to keep the air out of the dispensing system in order for the operator to pump the liquid dye efficiently. The stopper and a small aperture at the bottom of the plastic bottle are replacing the one-way valve currently used in many hair dye-dispensing devices. With interchangeable comb heads, the operator can choose the proper comb head for his hair type and different application purpose.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.