Abstract: The disclosure provides example apparatus and methods for automatically adjusting a socket size of a prosthesis. The apparatus includes (a) the prosthesis having a socket configured to receive a limb, (b) a first opening in a socket wall, (c) a first panel aligned with the first opening, (d) a first actuator coupled to the first panel and to the prosthesis, the first actuator is configured to advance and retract the first panel, (e) a first sensor coupled to the socket wall and configured to obtain limb-to-socket gap data, and (f) a processor coupled to the first actuator and the first sensor, wherein the processor is configured (i) to receive the limb-to-socket gap data, (ii) to determine a socket-size adjustment based on the limb-to-socket gap data and a predetermined socket-fit value, (iii) to generate and (iv) to send a command with the socket-size adjustment to the first actuator.

Abstract: Integrated circuit (IC) package employing metal posts thermally coupling a die to an interposer substrate for dissipating thermal energy of the die are disclosed. In one aspect, the IC package includes a metal post(s) thermally coupled to the die. The metal post(s) is attached to metal interconnect(s) (e.g., metal trace, metal pad, metal line, metal plate) in the interposer substrate. In this manner, as thermal energy is generated in the die, this thermal energy dissipates through the metal post(s) and through the coupled metal interconnect(s) into the interposer substrate. Thus, metal interconnects, which are an available feature in an interposer substrate fabrication process, are deployed to form the foundation upon which metal posts are fabricated and thermally coupled to the die to provide heat dissipation for the die in the IC package.

Abstract: A package comprising a substrate and a second integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects comprising a first plurality of interconnects, and a first integrated device located at least partially in the substrate. The first integrated device is coupled to the first plurality of interconnects through a first plurality of solder interconnects. The second integrated device is coupled to the first plurality of interconnects through a second plurality of solder interconnects.

Abstract: Disclosed are apparatuses and methods for fabricating the apparatuses. In an aspect, an apparatus may include: an interposer including a first metal layer, a second metal layer, a plurality of vias configured to thermally and electrically couple the first metal layer and the second metal layer, and a plurality of solder resist posts disposed on a bottom surface portion of the second metal layer; a package substrate; a die electrically coupled to the package substrate; and a thermal interface material (TIM) disposed on the die, where the TIM is configured to thermally coupled the die and the bottom surface portion of the second metal layer.

Abstract: Embedded trace substrates (ETS) having an ETS metallization layer with T-shaped interconnects with reduced-width embedded metal traces, and related integrated circuit (IC) packages and fabrication methods. The ETS includes an outer ETS metallization layer that includes T-shaped interconnects for supporting input/output (I/O) connections between the ETS and another opposing package substrate. To increase density of I/O interconnections, the pitch of the embedded metal traces in the ETS metallization layer is reduced. The T-shaped interconnects also each include an additional metal contact pad that is coupled to a respective embedded metal trace to increase the height of the embedded metal trace to eliminate a vertical connection gap between the ETS and an opposing package substrate.

Abstract: A dispensing device, having a hollow nipple-shaped stopper configured to act as a one-way valve, for use as a hair dyeing comb is provided. The nipple-shaped stopper has an aperture at its tip end. The aperture opens toward outside when the operator compresses the plastic bottle and closes when the operator releases the plastic bottle. When the aperture is in its closed position, the stopper prevents the liquid hair dye already in the conduit from flowing back to the plastic bag inside the bottle. The purpose of using the stopper here is to keep the air out of the dispensing system in order for the operator to pump the liquid dye efficiently. The stopper and a small aperture at the bottom of the plastic bottle are replacing the one-way valve currently used in many hair dye-dispensing devices. With interchangeable comb heads, the operator can choose the proper comb head for his hair type and different application purpose.

Abstract: The present invention discloses a device, which comprises a double burette syringe, a stopper, a slidable plate for mixing, and a plurality of mixing bars easily detachable from the mixing plate. This invention relates to devices for storing, delivering, and mixing of a two component double burette syringe.

Abstract: A dispensing device, having a hollow nipple-shaped stopper configured to act as a one-way valve, for use as a hair dyeing comb is provided. The nipple-shaped stopper has an aperture at its tip end. The aperture opens toward outside when the operator compresses the plastic bottle and closes when the operator releases the plastic bottle. When the aperture is in its closed position, the stopper prevents the liquid hair dye already in the conduit from flowing back to the plastic bag inside the bottle. The purpose of using the stopper here is to keep the air out of the dispensing system in order for the operator to pump the liquid dye efficiently. The stopper and a small aperture at the bottom of the plastic bottle are replacing the one-way valve currently used in many hair dye-dispensing devices. With interchangeable comb heads, the operator can choose the proper comb head for his hair type and different application purpose.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.

Abstract: A method of electrical isolation for printed circuit board gasketing is disclosed for enabling gasketing to overlay plated through holes without shorting out thereto. The method of electrical isolation for printed circuit board gasketing includes counterboring at a controlled width to a controlled depth those plated through holes underlying the gasketing. The method provides the advantage of being able to overlay gasketing on both surfaces of a printed circuit board mid-plane. The method of electrical isolation for printed circuit board gasketing is particularly useful for overcoming the additional material requirements and processing steps of electrical isolation known in the art.