Patents by Inventor Joanna Dziewiszek

Joanna Dziewiszek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of filling through-holes to reduce voids and other defects
    Patent number: 10508357
    Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Nagarajan Jayaraju, Leon Barstad, Zuhra Niazimbetova, Joanna Dziewiszek
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
    Patent number: 10508349
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
    Patent number: 10190228
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: January 29, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
    Patent number: 10100421
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
    Patent number: 10104782
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
    Patent number: 9932684
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 3, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRAZOLE COMPOUNDS AND BISEPOXIDES
    Publication number: 20170370014
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES
    Publication number: 20170283970
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Application
    Filed: March 7, 2017
    Publication date: October 5, 2017
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    Publication number: 20170233886
    Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
    Type: Application
    Filed: December 20, 2016
    Publication date: August 17, 2017
    Inventors: Nagarajan Jayaraju, Leon Barstad, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
    Publication number: 20170037527
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES
    Publication number: 20170042037
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS
    Publication number: 20170037526
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Polymorphs of N-malonyl-bis(N?-methyl-N?-thiobenzoylhydrazide)
    Patent number: 9051250
    Abstract: At least 70% by weight of Compound 1 is the single crystalline form, Form A, Form C, or Form D, of the compound. A pharmaceutical composition comprises a pharmaceutically acceptable carrier or diluent, and compound 1, wherein at least 70% by weight of the compound is the single crystalline form, Form A, Form C, or Form D, of the compound. A method of treating a subject with cancer comprises administering to the subject an effective amount of compound 1 or the pharmaceutical composition.
    Type: Grant
    Filed: January 27, 2014
    Date of Patent: June 9, 2015
    Assignee: Synta Pharmaceuticals Corp.
    Inventors: Elena Kostik, Lijun Sun, Joanna Dziewiszek, Jun Y. Choi
  • POLYMORPHS OF N-MALONYL-BIS(N`-METHYL-N`-THIOBENZOYLHYDRAZIDE)
    Publication number: 20140350115
    Abstract: At least 70% by weight of Compound 1 is the single crystalline form, Form A, Form C, or Form D, of the compound. A pharmaceutical composition comprises a pharmaceutically acceptable carrier or diluent, and compound 1, wherein at least 70% by weight of the compound is the single crystalline form, Form A, Form C, or Form D, of the compound. A method of treating a subject with cancer comprises administering to the subject an effective amount of compound 1 or the pharmaceutical composition.
    Type: Application
    Filed: January 27, 2014
    Publication date: November 27, 2014
    Applicant: SYNTA PHARMACEUTICALS CORP.
    Inventors: Elena Kostik, Lijun Sun, Joanna Dziewiszek, Jun Y. Choi
  • Polymorphs of N-malonyl-bis(N?-methyl-N?-thiobenzoylhydrazide)
    Patent number: 8637704
    Abstract: At least 70% by weight of Compound 1 is the single crystalline form, Form A, Form C, or Form D, of the compound. A pharmaceutical composition comprises a pharmaceutically acceptable carrier or diluent, and compound 1, wherein at least 70% by weight of the compound is the single crystalline form, Form A, Form C, or Form D, of the compound. A method of treating a subject with cancer comprises administering to the subject an effective amount of compound 1 or the pharmaceutical composition.
    Type: Grant
    Filed: November 28, 2008
    Date of Patent: January 28, 2014
    Assignee: Synta Pharmaceuticals Corp.
    Inventors: Elena Kostik, Lijun Sun, Joanna Dziewiszek, Jun Y. Choi
  • Polymorphs of N-Malonyl-Bis(N'-Methyl-N'-Thiobenzoylhydrazide)
    Publication number: 20110196025
    Abstract: At least 70% by weight of Compound 1 is the single crystalline form, Form A, Form C, or Form D, of the compound. A pharmaceutical composition comprises a pharmaceutically acceptable carrier or diluent, and compound 1, wherein at least 70% by weight of the compound is the single crystalline form, Form A, Form C, or Form D, of the compound. A method of treating a subject with cancer comprises administering to the subject an effective amount of compound 1 or the pharmaceutical composition.
    Type: Application
    Filed: November 28, 2008
    Publication date: August 11, 2011
    Applicant: Synta Pharmaceuticals Corp.
    Inventors: Elena I. Kostik, Lijun Sun, Joanna Dziewiszek, Jun Y. Choi