Patents by Inventor Joanne Huang

Joanne Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220331416
    Abstract: Provided is a nucleic acid encoding a chimeric CD3 fusion protein and an anti-CD3 based bispecific T cell activator (BiTA) element. Also provided are vectors, engineered immune cells comprising the nucleic acid, the usage thereof and methods for preventing tumor. BiTA secreted by CAB-T cells can simultaneously achieve activation of CAB-T cells and endogenous TCR complexes in non-engineered T cells in tumor, and exert an anti-tumor effect.
    Type: Application
    Filed: September 7, 2020
    Publication date: October 20, 2022
    Inventors: Zhiyuan LI, Gang YI, Andy TSUN, Xiaolin LIU, Weifeng Joanne HUANG, Shaogang PENG
  • Publication number: 20210215438
    Abstract: A thermal storage system that includes one or more thermal storage tanks having a tank body that defines a tank cavity configured to hold a tank thermal storage medium; a heat exchanger assembly disposed in the tank cavity configured to run a flow of working thermal storage medium through the one or more thermal storage tanks so that heat exchange occurs between the flow of working thermal storage medium and the tank thermal storage medium; one or more cables that extend to one or more rooms of the building; and one or more heat exchange elements disposed within the one or more rooms configured to receive a flow of the working thermal storage medium from the one or more cables so that heat exchange occurs between the flow of the working thermal storage medium and an environment of the one or more rooms of the building.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 15, 2021
    Inventors: Saul Thomas Griffith, Brenton Piercy, Hans von Clemm, Pushan Panda, Joanne Huang
  • Patent number: 10950736
    Abstract: Roughly described, a transistor is formed with a semiconductor 2D material layer wrapped conformally on at least part of a 3D structure. The 3D structure can be for example a ridge made of a dielectric material, or made of dielectric material alternating longitudinally with a semiconductive or conductive material. Alternatively the 3D structure can be tree-shaped. Other shapes are possible as well. Aspects also include methods for making such structures, as well as integrated circuit layouts defining such structures and methods for developing such layouts, a machine readable data storage medium storing design entries which include some which define such structures and layouts, methods for developing such design entries. Aspects further include corrugated wafers which are prepared as an intermediate product for use in fabricating integrated circuits having a semiconductor 2D material layer disposed conformally on a 3D structure.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: March 16, 2021
    Assignee: Synopsys, Inc.
    Inventors: Victor Moroz, Joanne Huang, Jamil Kawa
  • Publication number: 20200006578
    Abstract: Roughly described, a transistor is formed with a semiconductor 2D material layer wrapped conformally on at least part of a 3D structure. The 3D structure can be for example a ridge made of a dielectric material, or made of dielectric material alternating longitudinally with a semiconductive or conductive material. Alternatively the 3D structure can be tree-shaped. Other shapes are possible as well. Aspects also include methods for making such structures, as well as integrated circuit layouts defining such structures and methods for developing such layouts, a machine readable data storage medium storing design entries which include some which define such structures and layouts, methods for developing such design entries. Aspects further include corrugated wafers which are prepared as an intermediate product for use in fabricating integrated circuits having a semiconductor 2D material layer disposed conformally on a 3D structure.
    Type: Application
    Filed: September 9, 2019
    Publication date: January 2, 2020
    Applicant: Synopsys, Inc.
    Inventors: Victor Moroz, Joanne Huang, Jamil Kawa
  • Patent number: 10411135
    Abstract: Roughly described, a transistor is formed with a semiconductor 2D material layer wrapped conformally on at least part of a 3D structure. The 3D structure can be for example a ridge made of a dielectric material, or made of dielectric material alternating longitudinally with a semiconductive or conductive material. Alternatively the 3D structure can be tree-shaped. Other shapes are possible as well. Aspects also include methods for making such structures, as well as integrated circuit layouts defining such structures and methods for developing such layouts, a machine readable data storage medium storing design entries which include some which define such structures and layouts, methods for developing such design entries. Aspects further include corrugated wafers which are prepared as an intermediate product for use in fabricating integrated circuits having a semiconductor 2D material layer disposed conformally on a 3D structure.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: September 10, 2019
    Assignee: Synopsys, Inc.
    Inventors: Victor Moroz, Joanne Huang, Jamil Kawa
  • Publication number: 20180182898
    Abstract: Roughly described, a transistor is formed with a semiconductor 2D material layer wrapped conformally on at least part of a 3D structure. The 3D structure can be for example a ridge made of a dielectric material, or made of dielectric material alternating longitudinally with a semiconductive or conductive material. Alternatively the 3D structure can be tree-shaped. Other shapes are possible as well. Aspects also include methods for making such structures, as well as integrated circuit layouts defining such structures and methods for developing such layouts, a machine readable data storage medium storing design entries which include some which define such structures and layouts, methods for developing such design entries. Aspects further include corrugated wafers which are prepared as an intermediate product for use in fabricating integrated circuits having a semiconductor 2D material layer disposed conformally on a 3D structure.
    Type: Application
    Filed: June 8, 2016
    Publication date: June 28, 2018
    Applicant: Synopsys, Inc.
    Inventors: Victor Moroz, Joanne Huang, Jamil Kawa
  • Publication number: 20110159047
    Abstract: The present invention is directed to methods for preparing a stable powder formulation of an alum-adsorbed vaccine. The methods comprise atomizing a liquid formulation comprising an immunogen adsorbed onto an aluminum adjuvant to produce an atomized formulation, freezing the atomized formulation to produce frozen particles, and drying the frozen particles to produce dried powder particles. Pharmaceutical compositions comprising a stable powder formulation of an alum-adsorbed vaccine are also disclosed herein. The pharmaceutical compositions are stable at high temperatures and can be reconstituted in a pharmaceutically acceptable carrier to produce a reconstituted liquid vaccine that exhibits little or no particle agglomeration and retains immunogenicity. Methods of using the alum-adsorbed vaccine compositions for preventing and treating a disease in a subject, wherein the disease is associated with the particular immunogen, are further provided.
    Type: Application
    Filed: November 23, 2010
    Publication date: June 30, 2011
    Applicant: Becton, Dickinson and Company
    Inventors: Vincent J. Sullivan, John A. Mikszta, Jason B. Alarcon, Matthew S. Ferriter, Joanne Huang, Ajit M. D'Souza
  • Publication number: 20080226729
    Abstract: The present invention is directed to methods for preparing a stable powder formulation of an alum-adsorbed vaccine. The methods comprise atomizing a liquid formulation comprising an immunogen adsorbed onto an aluminum adjuvant to produce an atomized formulation, freezing the atomized formulation to produce frozen particles, and drying the frozen particles to produce dried powder particles. Pharmaceutical compositions comprising a stable powder formulation of an alum-adsorbed vaccine are also disclosed herein. The pharmaceutical compositions are stable at high temperatures and can be reconstituted in a pharmaceutically acceptable carrier to produce a reconstituted liquid vaccine that exhibits little or no particle agglomeration and retains immunogenicity. Methods of using the alum-adsorbed vaccine compositions for preventing and treating a disease in a subject, wherein the disease is associated with the particular immunogen, are further provided.
    Type: Application
    Filed: September 10, 2007
    Publication date: September 18, 2008
    Applicant: Becton, Dickinson and Company
    Inventors: Vincent J. Sullivan, John A. Mikszta, Jason B. Alarcon, Matthew S. Ferriter, Joanne Huang, Ajit M. D'Souza