Abstract: A method of enhancing a resolution of an EDS image of a sample includes generating an EDS image of the sample, generating a non-EDS image of the sample generating, using a machine learning algorithm, an enhanced resolution EDS image of the sample based on the generated feature map and based on the first EDS image, where a resolution of the enhanced resolution EDS image is higher than a resolution of the first EDS image.

Abstract: A method of enhancing a resolution of an EDS image of a sample includes generating an EDS image of the sample, generating a non-EDS image of the sample generating, using a machine learning algorithm, an enhanced resolution EDS image of the sample based on the generated feature map and based on the first EDS image, where a resolution of the enhanced resolution EDS image is higher than a resolution of the first EDS image.

Abstract: A method includes obtaining at least one 2-D image dataset of semiconductor structures formed on a wafer including one or more defects during a wafer run of a wafer using a predefined fabrication process. The method also includes determining, based on at least one machine-learning algorithm trained on prior knowledge of the fabrication process and based on the at least one 2-D image dataset, one or more process deviations of the wafer run from the predefined fabrication process as a root cause of the one or more defects. A 3-D image dataset may be determined as a hidden variable.

Abstract: A method, including: recording plural images of an object by scanning plural particle beams across the object and detecting signals generated by the particle beams, wherein the plural particle beams are generated by a multi-beam particle microscope; determining plural regions of interest; determining plural image regions in each of the recorded images; determining plural displacement vectors; and determining image distortions based on image data of the recorded images and the determined displacement vectors.

Abstract: A method of enhancing a resolution of an EDS image of a sample includes generating an EDS image of the sample, generating a non-EDS image of the sample generating, using a machine learning algorithm, an enhanced resolution EDS image of the sample based on the generated feature map and based on the first EDS image, where a resolution of the enhanced resolution EDS image is higher than a resolution of the first EDS image.

Abstract: A method, including: recording plural images of an object by scanning plural particle beams across the object and detecting signals generated by the particle beams, wherein the plural particle beams are generated by a multi-beam particle microscope; determining plural regions of interest; determining plural image regions in each of the recorded images; determining plural displacement vectors; and determining image distortions based on image data of the recorded images and the determined displacement vectors.

Abstract: A method includes obtaining at least one 2-D image dataset of semiconductor structures formed on a wafer including one or more defects during a wafer run of a wafer using a predefined fabrication process. The method also includes determining, based on at least one machine-learning algorithm trained on prior knowledge of the fabrication process and based on the at least one 2-D image dataset, one or more process deviations of the wafer run from the predefined fabrication process as a root cause of the one or more defects. A 3-D image dataset may be determined as a hidden variable.