Patents by Inventor Jobelito Anjao Guanzon

Jobelito Anjao Guanzon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bond pad and clip configuration for packaged semiconductor device
    Patent number: 10692801
    Abstract: A semiconductor device package includes a die pad having a die attach surface, a first lead that is spaced apart and extends away from a first side of the die pad, and a semiconductor die mounted on the die attach surface. The semiconductor die includes a first bond pad disposed on an upper side of the semiconductor die that is opposite the die attach surface. A first clip electrically connects the first lead to the first bond pad. The first bond pad is elongated with first and second longer edge sides that are opposite one another and extend along a length of the first bond pad. The semiconductor die is oriented such that the first and second longer edge sides of the first bond pad are non-parallel to a first current flow direction of the first clip that extends between the first bond pad and the first lead.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: June 23, 2020
    Assignee: Infineon Technologies Austria AG
    Inventors: Eung San Cho, Chuan Cheah, Jobelito Anjao Guanzon
  • Bond Pad and Clip Configuration for Packaged Semiconductor Device
    Publication number: 20190371711
    Abstract: A semiconductor device package includes a die pad having a die attach surface, a first lead that is spaced apart and extends away from a first side of the die pad, and a semiconductor die mounted on the die attach surface. The semiconductor die includes a first bond pad disposed on an upper side of the semiconductor die that is opposite the die attach surface. A first clip electrically connects the first lead to the first bond pad. The first bond pad is elongated with first and second longer edge sides that are opposite one another and extend along a length of the first bond pad. The semiconductor die is oriented such that the first and second longer edge sides of the first bond pad are non-parallel to a first current flow direction of the first clip that extends between the first bond pad and the first lead.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 5, 2019
    Inventors: Eung San Cho, Chuan Cheah, Jobelito Anjao Guanzon