Patents by Inventor Jocel Gomezl

Jocel Gomezl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip MLP with folded heat sink
    Patent number: 7812437
    Abstract: A semiconductor package assembly including a molded leadless package (MLP) having an exposed top emitter pad and an exposed bottom source pad. A folded heat sink is attached to the exposed top emitter pad of the MLP by a soft solder attach process. The folded heat sink has a planar member generally coextensive in size with the MLP and in electrical and thermal contact with the top emitter pad of the MLP, and also has one or more leads extending generally perpendicularly to the planar member in a direction towards the lower surface of the MLP. These heat sink leads may provide the emitter connection to a printed circuit (PC) board.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: October 12, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jonathan A. Noquil, Yong Liu, Jocel Gomezl