Patents by Inventor Jochem Sebastiaan Wildenberg

Jochem Sebastiaan Wildenberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210003927
    Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
    Type: Application
    Filed: September 17, 2020
    Publication date: January 7, 2021
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
  • Publication number: 20200356012
    Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 12, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Erik Johannes Maria WALLERBOS, Maurits VAN DER SCHAAR, Frank STAALS, Franciscus Hendricus Arnoldus ELICH
  • Patent number: 10816904
    Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method including: obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: October 27, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Davit Harutyunyan, Fei Jia, Frank Staals, Fuming Wang, Hugo Thomas Looijestijn, Cornelis Johannes Rijnierse, Maxim Pisarenco, Roy Werkman, Thomas Theeuwes, Tom Van Hemert, Vahid Bastani, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos, Erik Johannes Maria Wallerbos
  • Patent number: 10809631
    Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: October 20, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis Mos, Jochem Sebastiaan Wildenberg, Marcel Hendrikus Maria Beems, Erik Johannes Maria Wallerbos
  • Patent number: 10802408
    Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 13, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Everhardus Cornelis Mos, Jochem Sebastiaan Wildenberg, Erik Johannes Maria Wallerbos, Maurits Van Der Schaar, Frank Staals, Franciscus Hendricus Arnoldus Elich
  • Publication number: 20200278614
    Abstract: A method for determining a plurality of corrections for control of at least one manufacturing apparatus used in a manufacturing process for providing product structures to a substrate in a plurality of layers, the method including: determining the plurality of corrections including a correction for each layer, based on an actuation potential of the applicable manufacturing apparatus used in the formation of each layer, wherein the determining includes determining corrections for each layer simultaneously in terms of a matching parameter.
    Type: Application
    Filed: November 9, 2018
    Publication date: September 3, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Roy WERKMAN, Bijoy RAJASEKHARAN, Lydia Marianna VERGAIJ-HUIZER, Jochem Sebastiaan WILDENBERG, Ronald VAN ITTERSUM, Pieter Gerardus Jacobus SMORENBERG, Robertus Wilhelmus VAN DER HEIJDEN, Xiuhong WEI, Hadi YAGUBIZADE
  • Publication number: 20200264520
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Application
    Filed: May 1, 2020
    Publication date: August 20, 2020
    Applicant: ASML Netherlands B.V
    Inventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscu VAN HAREN, Jochem Sebastiaan WILDENBERG
  • Patent number: 10725372
    Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.
    Type: Grant
    Filed: January 20, 2016
    Date of Patent: July 28, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Wim Tjibbo Tel, Marinus Jochemsen, Frank Staals, Christopher Prentice, Laurent Michel Marcel Depre, Johannes Marcus Maria Beltman, Roy Werkman, Jochem Sebastiaan Wildenberg, Everhardus Cornelis Mos
  • Patent number: 10642162
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: May 5, 2020
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
  • Publication number: 20200026200
    Abstract: A method for optimizing a sequence of processes for manufacturing of product units, includes: associating measurement results of performance parameters (e.g., fingerprints) with the recorded process characteristics (e.g., context); obtaining a characteristic (e.g., context) of a previous process (e.g. deposition) in the sequence already performed on a product unit; obtaining a characteristic (e.g., context) of a subsequent process (e.g., exposure) in the sequence to be performed on the product unit; determining a predicted performance parameter (e.g., fingerprint) of the product unit associated with the sequence of previous and subsequent processes by using the obtained characteristics to retrieve measurement results of the performance parameters (e.g., fingerprints) corresponding to the recorded characteristics; and determining corrections to be applied to future processes (e.g. exposure, etch) in the sequence to be performed on the product unit, based on the determined predicted performance parameter.
    Type: Application
    Filed: March 28, 2018
    Publication date: January 23, 2020
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Jochem Sebastiaan WILDENBERG, Marinus JOCHEMSEN, Erik JENSEN, Erik Johannes Maria WALLERBOS, Cornelis Johannes RIJNIERSE, Bijoy RAJASEKHARAN, Roy WERKMAN, Jurgen Johannes Henerikus Maria SCHOONUS
  • Publication number: 20190317412
    Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.
    Type: Application
    Filed: October 16, 2017
    Publication date: October 17, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Erik Johannes Maria WALLERBOS, Maurits VAN DER SCHAAR, Frank STAALS, Franciscus Hendricus Arnoldus ELICH
  • Publication number: 20190311921
    Abstract: A substrate processing apparatus includes a substrate loading device configured to load a substrate in a predetermined orientation relative to a grid, having a X-axis and an orthogonal Y-axis, associated with a layout of fields on the substrate; and corrective elements configured to enable local correction of a characteristic of a process performed on a substrate, wherein the corrective elements are arranged along at least one axis having a direction other than parallel to the X-axis or the Y-axis of the grid.
    Type: Application
    Filed: September 21, 2017
    Publication date: October 10, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG
  • Publication number: 20190285992
    Abstract: A method to change an etch parameter of a substrate etching process, the method including: making a first measurement of a first metric associated with a structure on a substrate before being etched; making a second measurement of a second metric associated with a structure on a substrate after being etched; and changing the etch parameter based on a difference between the first measurement and the second measurement.
    Type: Application
    Filed: November 6, 2017
    Publication date: September 19, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Richard Johannes Franciscus VAN HAREN, Victor Emanuel CALADO, Leon Paul VAN DIJK, Roy WERKMAN, Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Marinus JOCHEMSEN, Bijoy RAJASEKHARAN, Erik JENSEN, Adam Jan URBANCZYK
  • Publication number: 20190278188
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 12, 2019
    Applicant: ASML Netherlands B.V.
    Inventors: Alexander YPMA, Jasper MENGER, David DECKERS, David HAN, Adrianus Cornelis Matheus KOOPMAN, Irina LYULINA, Scott Anderson MIDDLEBROOKS, Richard Johannes Franciscus VAN HAREN, Jochem Sebastiaan WILDENBERG
  • Publication number: 20190243252
    Abstract: A method for selecting an optimal set of locations for a measurement or feature on a substrate, the method includes: defining a first candidate solution of locations, defining a second candidate solution with locations based on modification of a coordinate in a solution domain of the first candidate solution, and selecting the first and/or second candidate solution as the optimal solution according to a constraint associated with the substrate.
    Type: Application
    Filed: September 21, 2017
    Publication date: August 8, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Pierluigi FRISCO, Svetla Petrova MATOVA, Jochem Sebastiaan WILDENBERG
  • Patent number: 10274834
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: April 30, 2019
    Assignee: ASML Netherlands B.V.
    Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
  • Publication number: 20190011842
    Abstract: A method of characterizing distortions in a lithographic process, and associated apparatuses. The method includes obtaining measurement data corresponding to a plurality of measurement locations on a substrate, the measurement data comprising measurements performed on a plurality of substrates, and comprising one or more measurements performed on one or more of the substrates for each of the measurement locations. For each of the measurement locations, a first quality value representing a quality metric and a noise value representing a noise metric is determined from the measurements performed at that measurement location. A plurality of distortion parameters is determined, each distortion parameter configured to characterize a systematic distortion in the quality metric and a statistical significance of the distortion parameters from the first quality value and from the noise value is determined. Systematic distortion is parameterized from the distortion parameters determined to be statistically significant.
    Type: Application
    Filed: February 22, 2017
    Publication date: January 10, 2019
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan WILDENBERG, Roy WERKMAN, Erik Johannes Maria WALLERBOS
  • Publication number: 20180307145
    Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.
    Type: Application
    Filed: April 12, 2018
    Publication date: October 25, 2018
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Everhardus Cornelis MOS, Jochem Sebastiaan Wildenberg, Marcel Hendrikus Maria Beems, Erik Johannes Maria Wallerbos
  • Publication number: 20180253015
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 6, 2018
    Applicant: ASML Netherlands B.V.
    Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg
  • Patent number: 9946165
    Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: April 17, 2018
    Assignee: ASML NETHERLANDS B.V.
    Inventors: Alexander Ypma, Jasper Menger, David Deckers, David Han, Adrianus Cornelis Matheus Koopman, Irina Lyulina, Scott Anderson Middlebrooks, Richard Johannes Franciscus Van Haren, Jochem Sebastiaan Wildenberg