Abstract: Systems and methods are directed localized heating for a modulator incorporated into an electro-absorption modulated laser (EML). A heater may be positioned proximate one or more portions of the modulator to apply heat energy to the modulator responsive to an input. The heater may be configured to apply a dissipation of heat so that the modulator operates within a selected temperature range. The modulator and/or the heater may be thermally insulated, at least in part, from a substrate associated with the EML by one or more low thermal conductivity layers arranged between the modulator and a substrate of the EML.

Abstract: Systems and methods are described herein for an electro-absorption modulator (EAM) device. An example EAM device comprises an optical waveguide comprising a waveguide core configured to facilitate propagation and modulation of an optical signal therethrough; a segmented structure comprising diode segments disposed on the waveguide; and an electrical transmission line operatively coupled to the diode segments. The electrical transmission line is configured to facilitate propagation of an electrical signal therethrough. The electrical transmission line includes a first transmission line rail and a second transmission line, where a first subset of diode segments is operatively coupled to the first transmission line rail and a ground rail, and a second subset of diode segments is operatively coupled to the second transmission line and the ground rail. The diode segments from the first subset are disposed alternately with the diode segments from the second subset.

Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.

Abstract: Systems and methods are described herein for an electro-absorption modulator (EAM) device. An example EAM device comprises an optical waveguide comprising a waveguide core configured to facilitate propagation of an optical signal therethrough; a segmented structure comprising diode segments disposed on the waveguide; and a differential electrical transmission line operatively coupled to the diode segments. The electrical transmission line includes a first transmission rail and a second transmission rail, and the electrical transmission line is configured to facilitate propagation of an electrical signal therethrough. The EAM device is configured for operation by a differential radio frequency (RF) source that is configured to supply the electrical signal to the EAM device, and the EAM device is formed on a semi-insulating substrate.

Abstract: A wafer includes a semiconductor substrate, multiple photonics devices and a test coupler. The multiple photonics devices are fabricated on the substrate and have multiple respective ports. The test coupler is disposed on the wafer and is configured to couple an optical test signal between a tester and the multiple ports of the multiple photonics devices during testing of the photonics devices.