Abstract: A computer-implemented method of predicting a quality of a printed circuit board (PCB) assembly includes obtaining production data relating to production of the PCB assembly. The production data is mapped onto a latent vector of a latent space of a trained adaptive algorithm. The trained adaptive algorithm is trained on real X-ray images of PCB assemblies and/or serves for generating X-ray images of PCB assemblies. A subspace of the latent space related to the latent vector is determined. The subspace indicates a quality of the PCB assembly. Alternatively or additionally, an X-ray image of the PCB assembly is generated by the trained adaptive algorithm based on the latent vector in order to determine a quality of the PCB assembly.

Abstract: A computer-implemented method of automated X-ray inspection during the production of printed circuit board, PCB, assemblies. The method includes capturing an X-ray image of a PCB assembly, determining a first error indicator based on image processing of the captured X-ray image, determining, in case the first error indicator indicates the PCB assembly as faulty, a second error indicator based on the captured X-ray image using a trained adaptive algorithm, and outputting the second error indicator as a result of the inspection.

Abstract: A computer-implemented method for assessing at least one printed circuit board includes receiving input data based on testing data of a printed circuit board, wherein the testing data represent in-circuit test testing data and include measurement data of a plurality of electronic components of the printed circuit board, applying a trained classification function to the input data, and generating and providing output data. The output data include an assignment of at least one of the electronic components to one of at least two different classes.