Abstract: A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

Abstract: A micromechanical component having a mount, an adjustable element, which is connected via at least one spring to the mount, and an actuator device, a first oscillatory motion of the adjustable element about a first axis of rotation and simultaneously a second oscillatory motion of the adjustable element, which is set into the first oscillatory motion, being excitable about a second axis of rotation in response to the actuator device; and the adjustable element being configured by the at least one spring to be adjustable on the mount in such a way that the adjustable element is adjustable by a resulting angular momentum about a rotational axis, which is oriented orthogonally to the first axis of rotation and orthogonally to second axis of rotation. Also, a method for manufacturing a micromechanical component. Moreover, a method for exciting a motion of an adjustable element about a rotational axis.

Abstract: A micromechanical pressure sensor device is equipped with a sensor substrate including a front side and a rear side. The device includes a pressure sensor unit suspended in the sensor substrate, a first cavity above the pressure sensor unit, which is exposed toward the front side via one or multiple access openings, one or multiple stress relief trenches, which laterally enclose the pressure sensor unit and form a fluidic connection from the rear side to the first cavity, and a circuit substrate, on which the rear side of the sensor substrate is bonded. A second cavity, which is in fluidic connection with the stress relief trenches, is formed below the pressure sensor unit in the circuit substrate. At least one channel is provided in a periphery of the pressure sensor unit, which is in fluidic connection with the second cavity and is exposed to the outside.

Abstract: A sensor element for a pressure sensor, includes a sensor membrane on which a defined number of piezoresistors are situated, the piezoresistors being configured in a circuit in such a way that, when there is a change in pressure an electrical change in voltage can be generated; at least two temperature measuring elements configured in relation to the sensor membrane in such a way that temperatures of the sensor membrane at positions of the piezoresistors can be measured using the temperature measuring elements, an electrical voltage present at the circuit of the piezoresistors due to a temperature gradient being capable of being compensated computationally using the measured temperatures.

Abstract: A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm that spans the cavity; and a lever element that spans the diaphragm and has a first and a second end section, the end sections lying on opposite sides of a center section. A first joint element is fitted between the first end section and the substrate and a second joint element is fitted between the center section and the diaphragm, so that the lever element is able to be pivoted due to a deflection of the diaphragm. In addition, two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes of the sensors are disposed in such a way that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Moreover, the sensor includes an actuator for applying an actuating force between the lever element and the substrate.

Abstract: A micromechanical component having a mount, an adjustable element, which is connected via at least one spring to the mount, and an actuator device, a first oscillatory motion of the adjustable element about a first axis of rotation and simultaneously a second oscillatory motion of the adjustable element, which is set into the first oscillatory motion, being excitable about a second axis of rotation in response to the actuator device; and the adjustable element being configured by the at least one spring to be adjustable on the mount in such a way that the adjustable element is adjustable by a resulting angular momentum about a rotational axis, which is oriented orthogonally to the first axis of rotation and orthogonally to second axis of rotation. Also, a method for manufacturing a micromechanical component. Moreover, a method for exciting a motion of an adjustable element about a rotational axis.

Abstract: A sensor element for a pressure sensor, includes a sensor membrane on which a defined number of piezoresistors are situated, the piezoresistors being configured in a circuit in such a way that, when there is a change in pressure an electrical change in voltage can be generated; at least two temperature measuring elements configured in relation to the sensor membrane in such a way that temperatures of the sensor membrane at positions of the piezoresistors can be measured using the temperature measuring elements, an electrical voltage present at the circuit of the piezoresistors due to a temperature gradient being capable of being compensated computationally using the measured temperatures.

Abstract: A mirror system including a mirror that is mounted in a manner that permits oscillation, having a coil and at least one first spring that intercouples the mirror and the coil in a way that allows the coil to be placed as a counterweight to the oscillating mirror. Also a corresponding projection device.

Abstract: Measures are described with the aid of which not only a rupture, but also cracks may be detected in the diaphragm structure of a micromechanical component with the aid of circuit means integrated into the diaphragm structure. At least some circuit elements are integrated for this purpose into the bottom side of the diaphragm, i.e., into a diaphragm area directly adjoining the cavern below the diaphragm.

Abstract: A micromechanical moisture sensor device includes: a substrate having a front side and a rear side; an interdigital printed conductor track arrangement provided above and/or below the front side of the substrate; and a moisture-sensitive polymer layer situated above and in the gaps of the interdigital printed conductor track arrangement. The moisture-sensitive polymer layer extends below the front side into the substrate.

Abstract: A micromechanical assembly having a holder, a drive frame which has at least one energizable coil device disposed at least one of on and in the drive frame and which is joined to the holder via at least one frame spring, a mirror element that is at least partially framed by the drive frame and is suspended from the drive frame by a first mirror spring and a second mirror spring, the mirror element being disposed between the two mirror springs and being adjustable about a mirror axis of rotation in relation to the drive frame, and the mirror element being suspended from the drive frame asymmetrically relative to the mirror axis of rotation. A method for manufacturing a micromechanical assembly is also described. A method for operating a micromechanical assembly is also described.

Abstract: A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Abstract: A mirror system including a mirror that is mounted in a manner that permits oscillation, having a coil and at least one first spring that intercouples the mirror and the coil in a way that allows the coil to be placed as a counterweight to the oscillating mirror. Also a corresponding projection device.

Abstract: A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.

Abstract: A micromechanical moisture sensor device includes: a substrate having a front side and a rear side; an interdigital printed conductor track arrangement provided above and/or below the front side of the substrate; and a moisture-sensitive polymer layer situated above and in the gaps of the interdigital printed conductor track arrangement. The moisture-sensitive polymer layer extends below the front side into the substrate.

Abstract: A micromechanical assembly having a holder, a drive frame which has at least one energizable coil device disposed at least one of on and in the drive frame and which is joined to the holder via at least one frame spring, a mirror element that is at least partially framed by the drive frame and is suspended from the drive frame by a first mirror spring and a second mirror spring, the mirror element being disposed between the two mirror springs and being adjustable about a mirror axis of rotation in relation to the drive frame, and the mirror element being suspended from the drive frame asymmetrically relative to the mirror axis of rotation. A method for manufacturing a micromechanical assembly is also described. A method for operating a micromechanical assembly is also described.

Abstract: Measures are described with the aid of which not only a rupture, but also cracks may be detected in the diaphragm structure of a micromechanical component with the aid of circuit means integrated into the diaphragm structure. At least some circuit elements are integrated for this purpose into the bottom side of the diaphragm, i.e., into a diaphragm area directly adjoining the cavern below the diaphragm.

Abstract: An infrared sensor having at least one measuring structure, which has, for example, a sensor chip having a measuring structure and a cap chip which is attached to the sensor chip and, together with the sensor chip, defines a sensor space; a screen having an internal screen area and an external screen area surrounding the internal screen area being formed on the top side of the cap chip; the internal screen area which is transparent to the infrared radiation to be detected being formed above the measuring structure, and the external screen area being at least partly non-transparent for the incident infrared radiation. The external screen area may be designed in particular as a reflective coating of metal or a dielectric layer, as reflective structuring formed by trenches having oblique surfaces, or as absorbing structuring.

Abstract: A rotation rate sensor having a substrate and a Coriolis element is proposed, the Coriolis element being situated above a surface of a substrate; the Coriolis element being able to be induced to vibrate in parallel to a first axis (X); an excursion of the Coriolis element being detectable, based on a Coriolis force in a second axis (Y), which is provided to be essentially perpendicular to the first axis (X); the first and second axes (X, Y) being provided parallel to the surface of the substrate, wherein force-conveying means are provided, the means being provided to convey a dynamic force effect between the substrate and the Coriolis element.