Abstract: A method for generating a surface that can be bonded with gold wire. The surface is obtained by first depositing an exchange palladium layer made of the electrolyte on conductors of printed circuit boards, in particular on conductors made of copper or conductive paste. The exchange palladium layer is then reinforced with a palladium layer, deposited from a chemical palladium electrolyte. In order to protect the palladium, an exchange gold layer is then applied. An exchange palladium bath is used, comprising an organic brightener.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.

Abstract: Compositions and methods for depositing gold alloys are disclosed. The compositions include certain dithiocarboxylic acids, salts and esters thereof and mercapto group containing compounds which provide bright gold alloy deposits with uniform color.

Abstract: A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.

Abstract: A tin-silver electrolyte and methods of depositing tin-silver alloys on a substrate.

Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition.

Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: Methods of electrodepositing layers of tin or tin-alloys on a substrate are provided. The methods involve electrolytically treating a substrate with a solution comprising a phosphoric acid and a carboxylic acid, and electrodepositing a layer of tin or tin-alloy on a surface of the treated substrate. The methods can provide tin or tin-alloy layers having a reduced tendency to form whiskers.

Abstract: The present invention provides inter alia electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;, &pgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

Abstract: Disclosed are electroless nickel plating composition including nickel, a reducing agent, a complexing agent, and an accelerator, wherein the accelerator is a mesoionic compound in an amount sufficient to accelerate the rate of deposition the composition

Abstract: Disclosed is a method of reducing whisker formation in tin films by the use of a thin metal undercoat. Also disclosed are structures having tin films with substantially reduced whisker formation.

Abstract: The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having &pgr; electrons that can be delocalized, e.g., an &agr;,&bgr; unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.