Abstract: A micromechanical component for a pressure sensor device. The component includes a substrate; a frame structure, mounted on a boundary surface of the substrate, including a diaphragm, whose inner diaphragm side borders on an interior volume, framed by the frame structure, so that when a pressure prevailing on its outer diaphragm side is above a reference pressure, the diaphragm is warped into the interior volume; and a rocker structure suspended on the inner diaphragm side, which in its operating mode is set into a rocker motion. An open gap exists between a stop face of the rocker structure and the boundary surface when a pressure prevailing on the outer diaphragm side is above the reference pressure and below a minimum operating pressure. The open gap is closed only when a pressure prevailing on the outer diaphragm side becomes greater or equal to the minimum operating pressure.

Abstract: A micromechanical component, whose diaphragm is supported and has support structures on its inner diaphragm side. Each of the support structures includes a first and second edge element structure, and at least one intermediate element structure positioned between the first and second edge element structures. For each of the support structures, a plane of symmetry is definable, with respect to which at least the first edge element structure of the respective support structure and the second edge element structure of the respective support structure are specularly symmetric. In each of support structures, a first maximum dimension of its first edge element structure perpendicular to its plane of symmetry and a second maximum dimension of its second edge element structure perpendicular to its plane of symmetry are greater than the maximum dimension of its intermediate element structure perpendicular to its plane of symmetry.

Abstract: An electrical contacting between a surrounding wiring and a conductor region. The conductor region is situated in a conductor layer above an SOI wafer or SOI chip. A cover layer is situated above the conductor layer and below the surrounding wiring. The cover layer has a contacting region. The contacting region is insulated from the rest of the cover layer by a first configuration of recesses. An opening is formed at least in the contacting region. A metallic material is situated in the opening. The metallic material connects the surrounding wiring and the conductor region.

Abstract: A micromechanical device that includes a MEMS substrate and a cap substrate that enclose at least one first cavity, with at least one contact pad that is situated outside the first cavity. A MEMS structure is situated in the first cavity and connected to the contact pad with the aid of a strip conductor, the strip conductor extending at least partially in the MEMS substrate. The contact pad is situated at a surface of the cap substrate.

Abstract: A micromechanical electrically actuable switch. The switch has a first relay with a first operating contact, and a second relay with a second operating contact. The first operating contact and the second operating contact are arranged in series in a common load path. The switch further includes a detection device for detecting a switching state of the first operating contact, and a control circuit for registering the switching state of the first operating contact and for switching on the electrically actuable switch. The control circuit is configured, upon a switch-on signal, to switch on the first relay and the second relay in a first case, in which the switching state of the first operating contact is “open”, and to not switch on at least the second relay in a second case, in which the switching state of the first operating contact is “closed”.

Abstract: A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

Abstract: A three-axis rotation rate sensor including a substrate and a double rotor. The double rotor includes a first rotor and a second rotor which are elastically connected to one another via a first coupling element so that the two rotors are excitable to rotary oscillations in phase opposition. The first rotor includes a first seismic mass and a second seismic mass that are deflectably supported with respect to the first rotor, and the second rotor includes a third seismic mass and a fourth seismic mass that are deflectably supported with respect to the second rotor. The first mass is connected to the third mass via a first rocker element so that upon a lateral deflection of the first mass, the third mass is deflected in a direction opposite the lateral deflection of the first mass.

Abstract: A micromechanical component for a sound transducer device. The micromechanical component includes a substrate, a diaphragm, at least one piezoelectric element, and at least one electrical contact connection. The diaphragm can vibrate and is connected to the substrate. The at least one piezoelectric element is disposed between the diaphragm and the substrate and is connected to the diaphragm. The at least one piezoelectric element is designed to produce and/or detect vibrations of the diaphragm in the ultrasonic range. The at least one electrical contact connection is electrically connected to the at least one piezoelectric element. The micromechanical component can be connected, using flip chip technology, to a control circuit such that the at least one piezoelectric element can be electrically connected to the control circuit by means of the at least one electrical contact connection.

Abstract: A micromechanical sensor structure. The micromechanical sensor structure including: a substrate; a mass which can be elastically deflected relative to the substrate; a measuring unit for detecting a deflection of the mass; and a damping structure for damping a deflection of the mass. The damping structure includes first and second damping combs which mesh together. The first damping comb is arranged on the mass and the second damping comb is arranged movably on a deflecting structure. When the mass is deflected in a first direction, the second damping comb is moved via the deflecting structure relative to the substrate in a second direction opposite the first direction.

Abstract: A method for manufacturing a micromechanical structure and a micromechanical structure. The method includes: forming a first micromechanical functional layer; forming a plurality of trenches in the first micromechanical functional layer, which include an upper widened area at the upper side of the first micromechanical functional layer and a lower area of essentially constant width; depositing a sealing layer on the upper side of the first micromechanical functional layer to seal the plurality of trenches, a sealing point of the plurality of trenches being formed below the upper side of the first micromechanical functional layer and the first trenches being at least partially filled; thinning back the sealing layer by a predefined thickness; and forming a second micromechanical functional layer above the thinned-back sealing layer.

Abstract: A MEMS relay. The MEMS relay includes: a movable switching element, on which a second switching surface is arranged in a first end section; a substrate having a first switching surface arranged thereon, which is designed to interact with the second switching surface; a switching electrode, to which an electrical switching voltage may be applied, the movable switching element being able to bring the second switching surface into contact with the first switching surface by way of an electrostatic force generated by the electrical switching voltage; at least one second compensation surface arranged in an end section of the movable switching element opposite the second switching surface; and a first compensation surface, which is designed to interact with the second compensation surface and is galvanically connected to the first switching surface via a cable.

Abstract: A pressure sensor device for a pressure sensor, in particular a capacitive pressure sensor, having a pressure chamber bounded by a movable sensing membrane and a stationary counterelectrode of the pressure sensor device. The sensing membrane and the counterelectrode each run in the longitudinal direction and the transverse direction of the pressure sensor device. The sensing membrane is directly or indirectly spring-mounted, in particular spring-mounted in two-dimensional fashion, in the pressure chamber relative to the counterelectrode by at least one micromechanical spring element, in particular a plurality of micromechanical spring elements.

Abstract: A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

Abstract: A device for detecting sound in the surroundings of an automobile, including a first structure-borne noise sensor, which is acoustically coupled to a first oscillating body at an outside of the automobile and provides a first audio signal, including a second audio signal, which represents sound from an interior of the automobile, and including a processing unit, which is configured to subtract at least the second audio signal from the first audio signal.

Abstract: A micromechanical device that includes a MEMS substrate and a cap substrate that enclose at least one first cavity, with at least one contact pad that is situated outside the first cavity. A MEMS structure is situated in the first cavity and connected to the contact pad with the aid of a strip conductor, the strip conductor extending at least partially in the MEMS substrate. The contact pad is situated at a surface of the cap substrate.

Abstract: A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.

Abstract: A method for temperature compensation of a MEMS sensor. The method includes: in a balancing step, a temperature gradient is produced by a thermal element and a first and a second temperature are determined at a first and a second temperature measurement point, wherein a deflection of a movable structure produced by the temperature gradient is measured and a compensation value is ascertained dependent on the first and second temperature and the deflection; in a measurement step, a physical stimulus is measured by way of a deflection of the movable structure and a third and fourth temperature is determined at the first and second temperature measurement points; in a compensation step, a measured value of the physical stimulus is ascertained dependent on the measured deflection, the third and fourth temperature and the compensation value. A method is also provided including: a regulation step, and a measurement step.

Abstract: A micromechanical component for a pressure and inertial sensor device. The component includes a substrate having an upper substrate surface; a diaphragm having an inner diaphragm side oriented towards the upper substrate surface and an outer diaphragm side pointing away from the upper substrate surface, the inner diaphragm side bordering on an inner volume, in which a reference pressure is enclosed, and the diaphragm being able to be warped using a pressure difference between a pressure prevailing on its outer diaphragm side and the reference pressure; and a seismic mass situated in the inner volume, a sensor electrode, which projects out on the inner diaphragm side and extends into the inner volume, being displaceable with respect to the substrate due to a warping of the diaphragm. A pressure and inertial sensor device, and a method of manufacturing a micromechanical component for a pressure and inertial sensor device, are also described.

Abstract: A micromechanical switch including a first substrate with a micromechanical functional layer in which a deflectable switching element is formed, and with a second substrate that is connected to the first substrate. The second substrate is situated at a distance above the switching element. The switching element includes an electrically conductive first contact area and is deflectable toward the second substrate. The second substrate, at an internal side, includes an electrically conductive second contact area that is situated in such a way that the switching element together with the first contact area may be applied to the second contact area in order to close an electrical contact. A method for manufacturing a micromechanical switch is also described.

Abstract: A MEMS switch that includes a substrate with a first insulating layer and a silicon layer thereabove, a fixed portion and a movable switching portion being formed in the silicon layer. A first metal layer is situated in recesses in the silicon layer at a side of the silicon layer facing away from the substrate, the first metal layer forming at least one switchable electrical contact between the fixed portion and the switching portion. A method for manufacturing a MEMS switch including at least one embedded metal contact is also described.