Patents by Inventor Jochen Stephan

Jochen Stephan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sensor component with cap over trench and sensor elements
    Patent number: 10693057
    Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.
    Type: Grant
    Filed: April 11, 2018
    Date of Patent: June 23, 2020
    Assignee: TDK-MICRONAS GMBH
    Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
  • Component with reduced stress forces in the substrate
    Patent number: 10103320
    Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: October 16, 2018
    Assignee: TDK-Micronas GmbH
    Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
  • COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE
    Publication number: 20180233658
    Abstract: A component is provided comprising at least one substrate, at least one magnetic field sensor and at least one trench in the at least one substrate surrounds the at least one magnetic field sensor at least partially. At least one cap covers the at least one trench and the at least one magnetic field sensor, and at least one layer element arranged between the at least one cap and the at least one substrate.
    Type: Application
    Filed: April 11, 2018
    Publication date: August 16, 2018
    Applicant: TDK-Micronas GmbH
    Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan
  • COMPONENT WITH REDUCED STRESS FORCES IN THE SUBSTRATE
    Publication number: 20170324028
    Abstract: A component with a magnetic field sensor. The electronic component is located in a semiconductor substrate or on the surface of the semiconductor substrate and is surrounded at least partially, preferably largely, by a trench in the semiconductor substrate. The trench is filled with a filling material.
    Type: Application
    Filed: May 4, 2016
    Publication date: November 9, 2017
    Inventors: Marc Baumann, Thilo Rubehn, Christian Joos, Jochen Stephan