Patents by Inventor Jochen Von Hagen
Jochen Von Hagen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8323991Abstract: A device and method are provided for detecting stress migration properties of a semiconductor module mounted in a housing. A stress migration test (SMT) structure is formed in the semiconductor module. An integrated heating (IH) device is formed within or in direct proximity to the SMT structure. The SMT structure includes a first interconnect region in a first interconnect layer, a second interconnect region in a second interconnect layer, and a connecting region electrically connecting the interconnect regions through a first insulating layer. The IH device includes a heating interconnect region through which a heating current flows. The heating interconnect region is within or outside the first or second interconnect region or connecting region. When the heating current is applied, a measurement voltage is applied to the SMT structure, and a current through the SMT structure is measured to detect stress migration properties of the semiconductor module.Type: GrantFiled: December 29, 2010Date of Patent: December 4, 2012Assignee: Infineon Technologies AGInventors: Armin Fischer, Alexander Von Glasow, Jochen Von Hagen
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Patent number: 8211720Abstract: A device and method are provided for detecting stress migration properties of a semiconductor module mounted in a housing. A stress migration test (SMT) structure is formed in the semiconductor module. An integrated heating (IH) device is formed within or in direct proximity to the SMT structure. The SMT structure includes a first interconnect region in a first interconnect layer, a second interconnect region in a second interconnect layer, and a connecting region electrically connecting the interconnect regions through a first insulating layer. The IH device includes a heating interconnect region through which a heating current flows. The heating interconnect region is within or outside the first or second interconnect region or connecting region. When the heating current is applied, a measurement voltage is applied to the SMT structure, and a current through the SMT structure is measured to detect stress migration properties of the semiconductor module.Type: GrantFiled: December 29, 2010Date of Patent: July 3, 2012Assignee: Infineon Technologies AGInventors: Armin Fischer, Alexander Von Glasow, Jochen Von Hagen
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Publication number: 20110097826Abstract: A device and method are provided for detecting stress migration properties of a semiconductor module mounted in a housing. A stress migration test (SMT) structure is formed in the semiconductor module. An integrated heating (IH) device is formed within or in direct proximity to the SMT structure. The SMT structure includes a first interconnect region in a first interconnect layer, a second interconnect region in a second interconnect layer, and a connecting region electrically connecting the interconnect regions through a first insulating layer. The IH device includes a heating interconnect region through which a heating current flows. The heating interconnect region is within or outside the first or second interconnect region or connecting region. When the heating current is applied, a measurement voltage is applied to the SMT structure, and a current through the SMT structure is measured to detect stress migration properties of the semiconductor module.Type: ApplicationFiled: December 29, 2010Publication date: April 28, 2011Applicant: Infineon Technologies AGInventors: Armin Fischer, Alexander Von Glasow, Jochen von Hagen
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Patent number: 7888672Abstract: A device and method are provided for detecting stress migration properties of a semiconductor module mounted in a housing. A stress migration test (SMT) structure is formed in the semiconductor module. An integrated heating (IH) device is formed within or in direct proximity to the SMT structure. The SMT structure includes a first interconnect region in a first interconnect layer, a second interconnect region in a second interconnect layer, and a connecting region electrically connecting the interconnect regions through a first insulating layer. The IH device includes a heating interconnect region through which a heating current flows. The heating interconnect region is within or outside the first or second interconnect region or connecting region. When the heating current is applied, a measurement voltage is applied to the SMT structure, and a current through the SMT structure is measured to detect stress migration properties of the semiconductor module.Type: GrantFiled: May 19, 2005Date of Patent: February 15, 2011Assignee: Infineon Technologies AGInventors: Armin Fischer, Alexander von Glasow, Jochen von Hagen
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Publication number: 20100283110Abstract: An integrated sensor chip unit and fabrication method includes a measured-value pickup for determining measurement data and a circuit arrangement for enabling a wireless power supply and interrogation of the measurement data. The measured-value pickup is formed as an integratable sensor, and the circuit arrangement is formed as an integrated semiconductor circuit module. The sensor and the semiconductor circuit module are mechanically and electrically conductively connected to one another using one or more microsystems engineering techniques.Type: ApplicationFiled: July 16, 2010Publication date: November 11, 2010Inventors: Robert Bauer, Jochen Von Hagen
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Publication number: 20060125494Abstract: The invention relates to an electromigration test apparatus having a direct-current source 101 and an AC voltage source 102. Furthermore, it has a circuit 104 having a conductive structure 100, which is electrically coupled to the direct-current source 101 and the AC voltage source 102, and a measuring device for measuring an electrical parameter which is indicative of electromigration in the conductive structure. The AC voltage source 102 is set up in such a way that it exposes the conductive structure 100 to an alternating current, independently of a direct current, and thus heats the conductive structure 100 to a predetermined temperature.Type: ApplicationFiled: June 25, 2003Publication date: June 15, 2006Inventor: Jochen Von Hagen
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Publication number: 20050211980Abstract: A device and method are provided for detecting stress migration properties of a semiconductor module mounted in a housing. A stress migration test (SMT) structure is formed in the semiconductor module. An integrated heating (IH) device is formed within or in direct proximity to the SMT structure. The SMT structure includes a first interconnect region in a first interconnect layer, a second interconnect region in a second interconnect layer, and a connecting region electrically connecting the interconnect regions through a first insulating layer. The IH device includes a heating interconnect region through which a heating current flows. The heating interconnect region is within or outside the first or second interconnect region or connecting region. When the heating current is applied, a measurement voltage is applied to the SMT structure, and a current through the SMT structure is measured to detect stress migration properties of the semiconductor module.Type: ApplicationFiled: May 19, 2005Publication date: September 29, 2005Inventors: Armin Fischer, Alexander von Glasow, Jochen von Hagen
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Patent number: 6873170Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.Type: GrantFiled: January 2, 2004Date of Patent: March 29, 2005Assignee: Infineon Technologies AGInventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
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Patent number: 6787799Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.Type: GrantFiled: July 23, 2002Date of Patent: September 7, 2004Assignee: Infineon Technologies AGInventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
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Publication number: 20040140826Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.Type: ApplicationFiled: January 2, 2004Publication date: July 22, 2004Applicant: Infineon Technologies AGInventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen
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Publication number: 20040036495Abstract: An electromigration test structure detects the reliability of wirings. A region to be tested has an electromigration region and an electromigration barrier region formed between first and second test structure terminal regions. In order to estimate a service life in a manner that is highly accurate and suitable for highly accelerated tests, a first and third sensor terminal are situated in direct proximity to the electromigration barrier region, and a second sensor terminal is situated at the second test structure terminal region.Type: ApplicationFiled: August 25, 2003Publication date: February 26, 2004Inventors: Josef Fazekas, Andreas Martin, Jochen Von Hagen
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Publication number: 20030020131Abstract: The invention relates to a device and a method for detecting the reliability of integrated semiconductor components. The device includes a carrier substrate for receiving an integrated semiconductor component that will be examined, a heating element, and a temperature sensor. The temperature sensor has at least a portion of a parasitic functional element of the semiconductor component. As a result, reliability tests can be carried out in a particularly accurate and space-saving manner.Type: ApplicationFiled: July 23, 2002Publication date: January 30, 2003Inventors: Wilhelm Asam, Josef Fazekas, Andreas Martin, David Smeets, Jochen Von Hagen