Abstract: Embodiments according to the disclosure have a measurement arrangement for an automated test equipment (ATE), for determining a beamforming characteristic of a device under test (DUT), wherein the measurement arrangement is adapted to carry an antenna and wherein the measurement arrangement is configured to manipulate position of the antenna relative to the DUT, to allow for a determination of the beamforming characteristic of the DUT when the DUT is coupled to a load board, and when the load board is electrically coupled to a test head of the ATE. Furthermore, the measurement arrangement is configured to be attached to the test head of the ATE or to a load board frame attached to the test head of the ATE.

Abstract: The present invention refers to an electronic apparatus, preferably a microchip testing device, comprising at least one circuit board mounted on a cooling device. This circuit board supports at least one microchip. The circuit board supports the microchip on a side turned to the cooling device, wherein the cooling device is adapted for providing a cooling of a side of the microchip, which side is turned to the cooling device. A thermal conductor is arranged between the microchip and the cooling device for providing a thermal contact between the cooling device and the one side of the microchip turned to the cooling device. The thermal conductor comprises at least one of a group comprising: a thermally conductive knead, a plasticine, a kneadable and thermally conductive material, and a plastically deformable and thermally conductive material.

Abstract: The present invention refers to an electronic apparatus, preferably a microchip testing device, comprising at least one circuit board mounted on a cooling device. This circuit board supports at least one microchip. The circuit board supports the microchip on a side turned to the cooling device, wherein the cooling device is adapted for providing a cooling of a side of the microchip, which side is turned to the cooling device. A thermal conductor is arranged between the microchip and the cooling device for providing a thermal contact between the cooling device and the one side of the microchip turned to the cooling device. The thermal conductor comprises at least one of a group comprising: a thermally conductive knead, a plasticine, a kneadable and thermally conductive material, and a plastically deformable and thermally conductive material.

Abstract: An interface provides an electrical contact between test equipment and application equipment. The interface receives plural individual structures. At least one of the structures comprises at least one electrical path that provides the electrical contact. At least one of the structures is electrically isolated with respect to the interface and/or other structures and has a ground condition substantially independent of the ground condition of the interface and/or other structures.

Abstract: Disclosed is an interface (300) for providing an electrical contact between a test equipment (25, 30) and an application equipment (10, 20). The interface (300) is adapted for receiving a plurality of individual segments (320i), whereby at least one of the segments (320i) comprises at least one electrical path (120, 130) for providing the electrical contact. At least one of the segments (320i) might be electrically isolated with respect to the interface (300) and/or other segments (320i), and can, have a ground condition substantially independent of the ground condition of the interface (300) and/or other segments (320i).