Abstract: A first conductor array (24, FIG. 5) of an electronic device (21) such as an integrated circuit is interconnected to a second conductor array (25) of a first substrate (22) by, first, using photolithographic masking and etching to make an array of substantially uniformly spaced apertures (15, FIG. 2) in a mask (11). The mask is located over a second substrate (12), and the apertures are used to form an array of substantially uniformly spaced metal particles (19). The metal particles are joined with insulative material (11) to form a layer of anisotropic conductive material (20), and the anisotropic conductive material layer is removed from the second substrate. The conductors (24) in the first conductor array of the electronic device are registered with conductors (25) of the second conductor array of the first substrate (22), and the layer of anisotropic conductive materials is compressed between the first and second conductor arrays.

Abstract: A compressible thermally conductive member comprises a polymer field with thermally conducting-magnetically aligned particles comprising a base portion and a multiplicity of protrusions extending from at least one surface of the base portion.

Abstract: A compressible thermally conductive member comprises a polymer field with thermally conducting magnetically aligned particles comprising a base portion and a multiplicity of protrusions extending from at least one surface of the base portion.