Abstract: This application relates to compositions comprising cellulose nanocrystals (CNCs) and photosensitizer molecules conjugated to the CNCs. In some embodiments the compositions generate reactive oxygen when exposed to light. Methods of preparing the compositions and using the compositions or formulations containing the compositions as biocidal disinfectants are also described. In some embodiment the photosensitizer molecules comprise cationic dyes with acidic protons, such as azure A. In some embodiments the CNC and photosensitizer molecules are coupled together using a pH mediated synthetic protocol whereby the photosensitizer molecules are first dispersed in an acidic suspension of oxidized CNCs and the suspension is then adjusted to an alkaline pH to facilitate photosensitizer fixation. In some embodiments, photobactericidal potency of the composition is significantly more toxic to a broad spectrum of bacteria than the light-activated photosensitizer molecules in a non-conjugated free form.

Abstract: Systems and methods for manufacturing modified impedance coaxial cables including providing a coaxial cable having an inner conductor, a dielectric layer at least partially covering an outer surface of the inner conductor, and an outer conductor at least partially covering an outer surface of the dielectric layer. The coaxial cable may include a first section having a first impedance configured to allow a first frequency band to pass. A discontinuity section may be formed in at least one of the inner conductor, the dielectric layer, and the outer conductor. The discontinuity section may have an impedance different than the first impedance and a length which is configured to attenuate a second frequency band.

Abstract: The present invention relates to a method of inhibiting biofilms by combinations of antimicrobials, particularly with their synergistic activity against bioFilms. The antimicrobials include combination of copper ion and quaternary ammonium compound or combination of copper ion and peroxide. The invention also include methods for inhibiting biofilm-induced microbial corrosion or fouling.

Abstract: In some embodiments a holder holds an electronic device at a distance from a board and couples the electronic device to the board. One or more legs stabilize and provide 360 degree support for the electronic device in a z-axis height away from the board. Other embodiments are described and claimed.

Abstract: A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and second set of contacts that are associated with the communication of signals and are not used to communicate power. Adjacent contacts of the first set have a first spacing, and adjacent contacts of the second set have a second spacing different from the first spacing. The circuit board has a retention profile to engage a retention mechanism of the slot connector. A housing of the slot connector may be made from a material that has a thermal conductivity of at least 0.27 W/m·K, and the slot connector housing may include fins that are formed on the slot connector to conduct heat away from circuitry of the circuit board.

Abstract: A system for delivering power to a processor from a DC-to-DC converter. The system provides contacts, which are attached from underneath and located all around the die, that enable the system to provide three hundred and sixty degree power delivery capabilities to the processor from the power pod.

Abstract: A tie wrap assembly comprises a tie wrap, for retaining a cable assembly, and a tie wrap base, for connecting the cable assembly to the chassis. The tie wrap includes a shaped engagement member for fittably coupling to an orifice within the tie wrap base. The tie wrap base is flexible, allowing the engagement member to be repeatedly inserted into and removed from the tie wrap base, as well as being fit through a hole in the chassis. One or more tie wrap bases are disposed at pre-arranged locations along the chassis. The tie wrap assembly allows cabling to be consistently routed along the pre-arranged locations, facilitating the consistent placement of cables in a mass production environment.

Abstract: A tie wrap assembly comprises a tie wrap, for retaining a cable assembly, and a tie wrap base, for connecting the cable assembly to the chassis. The tie wrap includes a shaped engagement member for fittably coupling to an orifice within the tie wrap base. The tie wrap base is flexible, allowing the engagement member to be repeatedly inserted into and removed from the tie wrap base, as well as being fit through a hole in the chassis. One or more tie wrap bases are disposed at pre-arranged locations along the chassis. The tie wrap assembly allows cabling to be consistently routed along the pre-arranged locations, facilitating the consistent placement of cables in a mass production environment.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: In order to make a connection to a test bus on a printed circuit board within a system or platform for the purpose of testing circuits within the system, a regular pattern of contact points which are coupled to the circuits to be tested are formed on the printed circuit board. The contact points are contacted with a plurality of spring loaded contacts, supported in a pattern which is the same as the pattern of contact points, with the spring loaded contacts being coupled to test equipment for testing the circuits.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: In order to make a connection to a test bus on a printed circuit board within a system or platform for the purpose of testing circuits within the system, a regular pattern of contact points which are coupled to the circuits to be tested are formed on the printed circuit board. The contact points are contacted with a plurality of spring loaded contacts, supported in a pattern which is the same as the pattern of contact points, with the spring loaded contacts being coupled to test equipment for testing the circuits.

Abstract: The computer peripheral bay cooling apparatus comprises a blower chassis adapted to fit within the 5¼ inch drive bay of a computer chassis and a blower enclosed within the blower chassis.

Abstract: An interconnected circuit module and motherboard use an electrical edge connector with conductive polymer contacts. The circuit module has electrical terminals along an edge of a front surface, and the electrical terminals extend to plated cylindrical grooves that are formed in the edge surface of the circuit module. The electrical edge connector is fastened to a surface of the motherboard and receives the edge terminals of the circuit module. When the circuit module is secured in the edge connector, the conductive polymer contacts are aligned with the cylindrical grooves of the circuit module and compressed against a land grid array on the surface of the motherboard. The connector is able to transmit electrical signals between the circuit module and the motherboard without the used of electrical pin connections.

Abstract: A circuit board includes a substrate and electrical contacts to mate with a slot connector. The contacts include a first set of contacts that are associated with the communication of power and second set of contacts that are associated with the communication of signals and are not used to communicate power. Adjacent contacts of the first set have a first spacing, and adjacent contacts of the second set have a second spacing different from the first spacing. The circuit board has a retention profile to engage a retention mechanism of the slot connector. A housing of the slot connector may be made from a material that has a thermal conductivity of at least0.27 W/m·K, and the slot connector housing may include fins that are formed on the slot connector to conduct heat away from circuitry of the circuit board.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.

Abstract: A system for delivering power to a processor enables a DC-to-DC converter substrate to be secured to the processor carrier in the Z-axis direction. The ability to assemble the converter to the processor in this way facilitates assembly compared to systems in which the converter is plugged in to the processor carrier in the direction substantially parallel to the surface of the motherboard.