Patents by Inventor Joe Adam Garcia

Joe Adam Garcia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGES WITH ELECTRICAL FUSES
    Publication number: 20240332243
    Abstract: In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
    Type: Application
    Filed: June 11, 2024
    Publication date: October 3, 2024
    Inventors: Mahmud Halim CHOWDHURY, Amin SIJELMASSI, Murali KITTAPPA, Anindya PODDAR, Honglin GUO, Joe Adam GARCIA, John Paul TELLKAMP
  • QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
    Patent number: 12087673
    Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: September 10, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Abram Castro, Usman Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury
  • Packages with electrical fuses
    Patent number: 12009336
    Abstract: In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: June 11, 2024
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mahmud Halim Chowdhury, Amin Sijelmassi, Murali Kittappa, Anindya Poddar, Honglin Guo, Joe Adam Garcia, John Paul Tellkamp
  • QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same
    Publication number: 20230057405
    Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a QFN device when it is attached to a printed wiring board (PWB).
    Type: Application
    Filed: November 8, 2022
    Publication date: February 23, 2023
    Inventors: Abram Castro, Usman Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury
  • PACKAGES WITH ELECTRICAL FUSES
    Publication number: 20230036643
    Abstract: In examples, a package comprises a semiconductor die having a device side and a bond pad on the device side, a conductive terminal exposed to an exterior of the package, and an electrical fuse. The electrical fuse comprises a conductive ball coupled to the bond pad, and a bond wire coupled to the conductive terminal. The bond wire is stitch-bonded to the conductive ball.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Inventors: Mahmud Halim CHOWDHURY, Amin SIJELMASSI, Murali KITTAPPA, Anindya PODDAR, Honglin GUO, Joe Adam GARCIA, John Paul TELLKAMP
  • QFN device having a mechanism that enables an inspectable solder joint when attached to a PWB and method of making same
    Patent number: 11495524
    Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: November 8, 2022
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Abram Castro, Usman Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury
  • QFN Device Having A Mechanism That Enables An Inspectable Solder Joint When Attached To A PWB And Method Of Making Same
    Publication number: 20190378783
    Abstract: An apparatus and method for providing an artificial standoff to the bottom of leads on a QFN device sufficient to provide a gap that changes the fluid dynamics of solder flow and create a unique capillary effect that drives solder up the of leads of a UN device when it is attached to a printed wiring board (PWB).
    Type: Application
    Filed: May 14, 2019
    Publication date: December 12, 2019
    Inventors: Abram Castro, Usman Chaudhry, Joe Adam Garcia, Mahmud Halim Chowdhury