Patents by Inventor Joe Albert Ojeda, Sr.

Joe Albert Ojeda, Sr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS package
    Patent number: 9012255
    Abstract: A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: April 21, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Joe Albert Ojeda, Sr.
  • Method for making a solder joint
    Patent number: 8925793
    Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.
    Type: Grant
    Filed: October 30, 2012
    Date of Patent: January 6, 2015
    Assignee: DunAn Microstaq, Inc.
    Inventors: Parthiban Arunasalam, Siddharth Bhopte, Joe Albert Ojeda, Sr.