Patents by Inventor Joe D. Dickson

Joe D. Dickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structuring and circuitizing printed circuit board through-holes
    Patent number: 7935895
    Abstract: Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: May 3, 2011
    Assignee: Cisco Technology, Inc.
    Inventors: David D. Senk, Joe D. Dickson
  • STRUCTURING AND CIRCUITIZING PRINTED CIRCUIT BOARD THROUGH-HOLES
    Publication number: 20080073113
    Abstract: Methods and apparatus for creating independent circuit connections within a through-hole of a substrate are described. According to one aspect of the present invention, a method includes defining a through-hole in a substrate, applying a conductive plating to a holewall of the through-hole, and selectively removing at least a first area of the plating. The through-hole has a height relative to a first axis, and the perimeter of the through-hole at each point along the first axis is approximately the same. Selectively removing the first area of the plating includes defining second areas of the plating. At least one of the plurality of second areas does not span a height of the hole.
    Type: Application
    Filed: September 26, 2006
    Publication date: March 27, 2008
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: DAVID D. SENK, JOE D. DICKSON