Abstract: This carrier for a plurality of transistors or other semiconductor devices comprises a unitized body of plastics material having inclined guide surfaces between adjacent guide walls of laterally spaced positioning blocks extending upwardly from a base of the carrier. These guide surfaces and walls guide the leads of the transistors into laterally spaced openings formed through the carrier base which align with openings in a printed circuit board after the carrier is attached to the board by snap-in fasteners. The transistors are seated and held in an upright and aligned position on the carrier by integral leaf-type springs which bias them against the front walls of the blocks for subsequent handling and wave soldering to the board.