Patents by Inventor Joe Dickson

Joe Dickson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board having a multi-signal via
    Publication number: 20070143995
    Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole. The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.
    Type: Application
    Filed: February 28, 2007
    Publication date: June 28, 2007
    Inventors: Joseph Tourne, Joe Dickson
  • Circuit board having a backdrilled multi-signal via
    Publication number: 20070089292
    Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole. The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.
    Type: Application
    Filed: July 7, 2006
    Publication date: April 26, 2007
    Inventors: Joseph Tourne, Joe Dickson
  • Circuit board having a multi-signal via
    Publication number: 20070089902
    Abstract: A method for producing a printed circuit board is described. A substrate having a via is provided with the via being coated with a conductive layer defining a perimeter of the via. The conductive layer defining an open via hole.The open via hole is filled with a non-conductive filling material. Then, the substrate is planed to remove any residue of the filling material on the surface of the substrate. Then, at least two holes are formed in the substrate with each hole overlapping the perimeter of the via and thereby removing a portion of the conductive layer and the filling material whereby the two holes in the substrate cooperate to form at least two electrically isolated segments in the conductive layer.
    Type: Application
    Filed: October 25, 2005
    Publication date: April 26, 2007
    Inventors: Joseph Tourne, Joe Dickson