Abstract: An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal.

Abstract: An embodiment of an integrated circuit (IC) is described. This embodiment of the IC includes an interposer; a first die on an interposer, where the first die generates a global signal propagated through the interposer; and a second die on the surface of the interposer and coupled to the global signal. The first die and the second die each is configured to implement a same operating state concurrently in response to the global signal.

Abstract: A method of configuring an integrated circuit (IC) can include receiving configuration data within a master die of the IC. The IC can include the master die and a slave die. A master segment and a slave segment of the configuration data can be determined. The slave segment of the configuration data can be distributed to the slave die of the IC.

Abstract: A method of testing input signals coupled to a circuit for performing a predetermined function is disclosed. The method comprises coupling input signals to inputs of the circuit by way of programmable interconnects; controlling the paths of the input signals within the circuit from the inputs to an output of the circuit; maintaining the states of the input signals coupled to the inputs of the circuit and routed to the output of the circuit; and testing output signals of the circuit to determine whether the correct input signals were provided to the inputs of the circuit by way of the programmable interconnects. A device having programmable logic which enables testing of input signals is also disclosed.