Abstract: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.

Abstract: Dynamic yield prediction. In accordance with a first method embodiment of the present invention, a computer-implemented method includes collecting sample test information from a plurality of test-only structures prior to completion of the first wafer, gathering finished test data from all die of the first wafer, after completion of the first wafer, constructing a yield prediction model based on the sample test information and on the finished test data, and predicting, using the model, a percentage of die of the first wafer that will meet a particular specification. The method may further include a feedback loop to dynamically update the model.

Abstract: Dynamic yield prediction. In accordance with a first method embodiment of the present invention, a computer-implemented method includes collecting sample test information from a plurality of test-only structures prior to completion of the first wafer, gathering finished test data from all die of the first wafer, after completion of the first wafer, constructing a yield prediction model based on the sample test information and on the finished test data, and predicting, using the model, a percentage of die of the first wafer that will meet a particular specification. The method may further include a feedback loop to dynamically update the model.

Abstract: An IC system includes low-power chips, e.g., memory chips, located proximate one or more higher power chips, e.g., logic chips, without suffering the effects of overheating. The IC system may include a high-power chip disposed on a packaging substrate and a low-power chip embedded in the packaging substrate to form a stack. Because portions of the packaging substrate thermally insulate the low-power chip from the high-power chip, the low-power chip can be embedded in the IC system in close proximity to the high-power chip without being over heated by the high-power chip. Such close proximity between the low-power chip and the high-power chip advantageously shortens the path length of interconnects therebetween, which improves device performance and reduces interconnect parasitics in the IC system.