Abstract: A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultraviolet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.

Abstract: A structure for protecting semiconductor integrated microcircuit dice during shipping. The structure secures the position of the die atop an ultra-violet (UV) light penetratable plate using a UV light sensitive adhesive layer. Once the structure reaches its destination, prior to removal of the die, the adhesive layer is exposed to ultraviolet light. This exposure reduces the adhesiveness or coefficient of friction of the layer, thereby facilitating die removal from the structure. The UV sensitive adhesive does not leave contaminating silicon residue on the removed die. The invention may be realized using currently commercially available UV tape and a modified die-pac having a UV light penetratable window.