Abstract: An interface assembly for a sensor array is provided. The interface assembly may be made up of an integrated circuit package thermally coupled to the sensor array. The interface assembly may include a temperature control system for controlling the temperature of the sensor array. The temperature control system includes a temperature sensor for sensing a temperature variation of each sensor of the sensor array from an initial temperature beyond a predetermined threshold. A temperature controller is coupled to each temperature sensor and receives an output signal from the temperature sensor upon the sensor temperature variation exceeding the predetermined threshold. A temperature correction device is coupled to each temperature controller and causes the sensor temperature variation to fall within the predetermined threshold upon receiving a control signal from the temperature controller.

Abstract: Disclosed herein is a method for assembly of Computed Tomography (CT) Detector electronic circuits. A thermally conductive adhesive is dispensed on a first side of a first circuit board, the first circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the first circuit board. The thermally conductive adhesive is also dispensed on a first side of a second circuit board, the second circuit board having a plurality of ball grid arrays and a plurality of thermal sensors attached to the first side of the second circuit board. A first heat sink is mounted to the first side of the first circuit board. A second heat sink mounted to the first side of the second circuit board. The adhesive is cured on the first and the second circuit boards. The first circuit board is attached to the second circuit board, wherein the second side of the first circuit board is adjacent to the second side of the second circuit board.