Patents by Inventor Joe Le

Joe Le has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10084241
    Abstract: A method of sending and receiving dual-polarization, millimeter-wave signals to and from a mobile device having a top surface, a bottom surface, and an edge surface, includes: radiating energy, in a millimeter-wave frequency band, from a first radiator outwardly from the edge surface with a first polarization; receiving, via the first radiator, energy in the millimeter-wave frequency band with the first polarization; radiating energy, in the millimeter-wave frequency band, from a second radiator outwardly from the edge surface with a second polarization substantially perpendicular to the first polarization, the second radiator being disposed between the first radiator and the top surface or the bottom surface, or a combination thereof; and receiving, via the second radiator, energy in the millimeter-wave frequency band with the second polarization.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: September 25, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Jatupum Jenwatanavet, Mohammad Ali Tassoudji, Joe Le
  • Patent number: 8618988
    Abstract: The present example provides a co-location insensitive multi-band antenna. The antenna may be co-located with an antenna operated at another band and tends to reject interference from that antenna. The co-location insensitive multi-band antenna tends to provide a compact design that may be printed on a printed wiring board, on a case of a radio, such as a cellular telephone or may be self supporting. In general, the desired in band performance and out of band signal rejection may be achieved by a meander line coupled to a upper band patch. The meander line tends to provide a good lower band match, and the upper band patch tends to provide a good high band match, or resonance. The upper band patch also tends to cause a sharp roll off in return loss before the high band, that tends to reject frequencies from a co-located antenna transmitting below the high band.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: December 31, 2013
    Assignee: KYOCERA Corporation
    Inventors: Jorge Fabrega-Sanchez, Joe Le
  • Publication number: 20090091508
    Abstract: Co-location insensitive multi-band antenna. The present example provides a co-location insensitive multi-band antenna. The antenna may be co-located with an antenna operated at another band and tends to reject interference from that antenna. The co-location insensitive multi-band antenna tends to provide a compact design that may be printed on a printed wiring board (“PWB”), on a case of a radio, such as a cellular telephone or may be self supporting. In general, the desired in band performance and out of band signal rejection may be achieved by a meander line coupled to a upper band patch. The meander line tends to provide a good lower bad match, and the upper band patch tends to provide a good high bad match, or resonance. The upper band patch also tends to cause a sharp roll off in return loss before the high band, that tends to reject frequencies from a co-located antenna transmitting below the high band.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 9, 2009
    Inventors: Jorge FABREGA-SANCHEZ, Joe Le
  • Patent number: 7482982
    Abstract: A wireless communication device is provided with a multipart case, having electrical interfaces that encourage the flow of radiation frequency ground current between case sections. The multipart case has a first planar groundplane section and a second planar groundplane section. For example, the multipart case design may be a slider, double slider, multiple hinge, flip, or swivel case. The second planar groundplane is substantially coplanar with the first groundplane in a case open position, and substantially bi-planar with the first groundplane in a case closed position. The wireless device also includes an antenna located adjacent the second groundplane section first end. A first and a second interface electrically connect the first groundplane section to the second groundplane section second end (the end opposite the antenna).
    Type: Grant
    Filed: February 16, 2006
    Date of Patent: January 27, 2009
    Assignee: Kyocera Wireless Corp.
    Inventors: Jatupum Jenwatanavet, Gregory Poilasne, Jorge Fabrega-Sanchez, Vaneet Pathak, Joe Le
  • Publication number: 20070120748
    Abstract: A wireless communication device is provided with a multipart case, having electrical interfaces that encourage the flow of radiation frequency ground current between case sections. The multipart case has a first planar groundplane section and a second planar groundplane section. For example, the multipart case design may be a slider, double slider, multiple hinge, flip, or swivel case. The second planar groundplane is substantially coplanar with the first groundplane in a case open position, and substantially bi-planar with the first groundplane in a case closed position. The wireless device also includes an antenna located adjacent the second groundplane section first end. A first and a second interface electrically connect the first groundplane section to the second groundplane section second end (the end opposite the antenna).
    Type: Application
    Filed: February 16, 2006
    Publication date: May 31, 2007
    Inventors: Jatupum Jenwatanavet, Gregory Poilasne, Jorge Fabrega-Sanchez, Vaneet Pathak, Joe Le