Patents by Inventor Joe Luis Martinez, Jr.

Joe Luis Martinez, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic assembly for removing heat from a semiconductor device
    Patent number: 6154369
    Abstract: An electronic assembly (20) having an insulated metal heat sink (10) and a method of manufacturing the electronic assembly (20). The electronic assembly (20) has a heat dissipater (11), a dielectric material (12), and a conductive layer (13). A semiconductor chip (21) is attached to the insulated metal heat sink (10). Heat generated by the semiconductor chip (21) is conducted to the conduction surface (14) of the heat dissipater (11). In one embodiment a convection surface (16) of the heat dissipater (11) is present and the heat is transferred from the convection surface (16) of the heat dissipater (11) to a fluid by convection. The fluid is directed by a manifold (64).
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: November 28, 2000
    Assignee: Motorola, Inc.
    Inventors: Joe Luis Martinez, Jr., Pablo Rodriguez, Martin Aaron Kalfus