Abstract: A package device includes a processing device, memory dies and a memory controller. The memory controller die is coupled to the processing device and the memory dies. The memory controller die controls communication from the processing device to the memory dies and to an external memory device. The external memory device is external to the memory dies.

Abstract: The disclosure relates to an integrated circuit including programmable control logic configured to generate at least one data pattern sequence from a number of stored data patterns and using the generated at least one data pattern sequence to at least one of read from and write to at least one memory device. A method includes generating at least one data pattern sequence from a number of stored data patterns and writing and reading the data pattern sequence from and to a memory device.

Abstract: The disclosure relates to a programmable virtual memory client, that includes programmable control logic configured to generate at least one data pattern sequence from a number of stored data patterns. Additionally, the virtual memory client includes virtual memory client control logic configured to use the generated at least one data pattern sequence to at least one of read from and write to at least one memory device. A method includes generating at least one data pattern sequence from a number of stored data patterns and writing and reading the data pattern sequence from and to a memory device.

Abstract: An impedance compensation circuit generates per-group pull-up impedance information and per-group pull-down impedance information to calibrate a plurality of input/output pads and dynamically updates impedance information on a per channel basis. A group refers to a group of I/O pads having similar output drive strengths in a channel. A channel refers to all I/O pads, which collectively provide a bus interface to an external device. For example, all the I/O pads interfacing with a memory module may be grouped into a channel, and address I/O pads in a channel may be arranged into a “group.” Memory I/O pads may be grouped together into a channel since memory interface pads have input/output characteristics that may be different from those of other types of I/O pads in the chip. According to one embodiment, per-group programmable offset information provides calibration information that may be different for each group in each channel.

Abstract: Methods and apparatus for transmitting and receiving data in a memory interface are disclosed. The apparatus include a programmable transceiver having a variable duty cycle control, with the transceiver having at least one of a programmable variable duty cycle receiver and a programmable variable duty cycle transmitter. The receiver and the transmitter are both responsive to variable duty cycle control data and operate to vary a duty cycle of one of incoming and outgoing data. By providing programmability to the data duty cycle, the transceiver can optimally accommodate different memory device standards.

Abstract: The disclosure relates to a programmable virtual memory client, that includes programmable control logic configured to generate at least one data pattern sequence from a number of stored data patterns. Additionally, the virtual memory client includes virtual memory client control logic configured to use the generated at least one data pattern sequence to at least one of read from and write to at least one memory device. A method includes generating at least one data pattern sequence from a number of stored data patterns and writing and reading the data pattern sequence from and to a memory device.

Abstract: An impedance compensation circuit generates per-group pull-up impedance information and per-group pull-down impedance information to calibrate a plurality of input/output pads and dynamically updates impedance information on a per channel basis. A group refers to a group of I/O pads having similar output drive strengths in a channel. A channel refers to all I/O pads, which collectively provide a bus interface to an external device. For example, all the I/O pads interfacing with a memory module may be grouped into a channel, and address I/O pads in a channel may be arranged into a “group.” Memory I/O pads may be grouped together into a channel since memory interface pads have input/output characteristics that may be different from those of other types of I/O pads in the chip. According to one embodiment, per-group programmable offset information provides calibration information that may be different for each group in each channel.