Patents by Inventor Joe P. Wang

Joe P. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6867543
    Abstract: A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: March 15, 2005
    Assignee: Motorola, Inc.
    Inventors: Joe P. Wang, Cheryl B. Field, Michael Pfeifer
  • Publication number: 20040189198
    Abstract: A microdevice assembly (20) that includes a device microstructure (22), a housing (30), and a fine grain getter layer (40). The housing (30) has a base portion (32) and a lid (34). The device microstructure (22) is attached to the base portion (32) and the lid (34) is hermetically sealed to the base portion (32). The housing (30) defines a cavity (38) surrounding the device microstructure (22). The fine grain getter layer (40) is on an interior side (42) of the lid (34) for maintaining a vacuum in the cavity (38) surrounding the device microstructure (22). The lid (34) may be made of metal or have at least a metallic surface in the region where the fine grain getter layer (40) is applied. The fine grain getter layer (40) has a sub-micron grain size. There is also a method for making the microdevice assembly (20).
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Inventors: Joe P. Wang, Cheryl B. Field, Michael Pfeifer
  • Patent number: 6427539
    Abstract: A reliable sensor provides a user-friendly semiconductor sensing device and transducer which accurately detects the characteristics of a fluid, such as pressure and strain, at high temperature operating conditions. The high performance sensor is particularly useful for use with diesel engines and internal combustion engines in vehicles. The sensor can comprise a single die with a transverse strain gauge or a group of strain gauges which are located at a position on the die to help minimize electric effects of thermal stress on the gauges during pressure detection and operation of the vehicle. The die can be glass fused, such as by glass frit, to a diaphragm, such as a stainless steel diaphragm, so as not to readily corrode in the fluid.
    Type: Grant
    Filed: July 31, 2000
    Date of Patent: August 6, 2002
    Assignee: Motorola, Inc.
    Inventors: Shiuh-Hui Steven Chen, Yanling Kang, Sut-Mui Tang, Joe P. Wang