Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.

Abstract: Toy dolls include a head having a face having an alterable appearance and a mechanism for altering the appearance of the face. The mechanism may include a first element configured to pivot about a first axis between a first position and a second position, a second element operatively coupled to the first element and configured to pivot about a second axis between a third position and a fourth position in response to the first element pivoting from the first position to the second position, and a third element operatively coupled to the first element and configured to pivot about a third axis between a fifth position and a sixth position in response to the first element pivoting from the first position to the second position. Pivoting the second element may alter a first aspect of the appearance of the face, and pivoting the third element may alter a second aspect of the appearance of the face.

Abstract: A toy doll may include a body supported by a skeletal structure including one or more joint assemblies. A joint assembly may include a pivot block further including a pivot stop, and a joint member rotatably coupled to the pivot block, the joint member further including a stop protrusion configured to engage the pivot stop upon rotation of the joint member in a predetermined direction, wherein engagement of the pivot stop prevents further rotation of the joint member in a predetermined direction, wherein the joint member is moveable through a predetermined range of motion transverse to the plane of rotation of the joint member, and wherein movement of the joint member transverse to the plane of rotation allows the stop protrusion to bypass the pivot stop.

Abstract: The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.