Abstract: A method and apparatus for transferring a semiconductor wafer in both a theta axis and a z-axis is provided. The apparatus is able to maintain maximum process and wafer throughput while minimizing the footprint of the processing machine by utilizing the concept of “vertical integration” to maximize the use of process slots and minimize the machine foot print. The wafer lift apparatus includes a bipolar electrostatic pick-up for engaging the article at an off-center position near an edge thereof. The electrostatic pick-up is positioned near one end of a transfer arm, the other end of the transfer arm being connected to a drive means for rotating the transfer arm and electrostatic pick-up in the theta axis, or vertically moving the transfer arm and electrostatic pick-up in the z-axis. The electrostatic pick-up is preferably connected to a power source by inductive coupling.

Abstract: A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations.

Abstract: A dual stage load lock is provided for transfer of semiconductor wafers between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber and a second load lock chamber separated by a dividing ledge which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations.

Abstract: An independent dual-blade robot assembly is provided for use in semiconductor wafer processing. The robot assembly includes a rotatable stage located within a chamber, a linear track mounted on an upper surface of the rotatable stage, and article first and second motorized platens slidably mounted on the linear track and configured for movement along a longitudinal axis of the linear track. Each motorized platen is magnetically driven and carries an end effector which extends from a leading edge. The end effectors of the first and second motorized platens are preferably horizontally coplanar. The linear track may be a single track carrying both motorized platens, or two linear track sections may be provided where each carries a single motorized platen. The two track sections may be pivotally or rotatably connected to the rotatable stage.

Abstract: An independent dual-blade robot assembly is provided for use in semiconductor wafer processing. The robot assembly includes a rotatable stage located within a chamber, a linear track mounted on an upper surface of the rotatable stage, and article first and second motorized platens slidably mounted on the linear track and configured for movement along a longitudinal axis of the linear track. Each motorized platen is magnetically driven and carries an end effector which extends from a leading edge. The end effectors of the first and second motorized platens are preferably horizontally co-planar. The linear track may be a single track carrying both motorized platens, or two linear track sections may be provided where each carries a single motorized platen. The two track sections may be pivotally or rotatably connected to the rotatable stage.

Abstract: A heating and lifting mechanism for positioning a semiconductor wafer within a processing chamber is provided including a pedestal for supporting the wafer within the process chamber, a drive shaft extending downwardly from a lower region of the pedestal, which has a lead screw at a distal portion thereof, and a drive mechanism, which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT.RTM. assembly located between the pedestal and drive shaft. The CONFLAT.RTM. assembly includes upper and lower substantially flat planar plates removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT.RTM. assembly permits removal of the heater pedestal without removing the entire lift assembly.