Patents by Inventor Joe Zunzi Zhao

Joe Zunzi Zhao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasive composition containing organic particles for chemical mechanical planarization
    Patent number: 6620215
    Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 16, 2003
    Assignee: Dynea Canada, Ltd.
    Inventors: Yuzhuo Li, Guomin Bian, Kwok Tang, Joe Zunzi Zhao, John Westbrook, Yong Lin, Leina Chan
  • Abrasive composition containing organic particles for chemical mechanical planarization
    Publication number: 20030136055
    Abstract: The present invention is drawn to a composition comprising abrasive particles comprising an organic resin for chemical mechanical planarization (CMP), which can be widely used in the semiconductor industry. The abrasive composition is an aqueous slurry comprising abrasive particles comprising an organic resin, wherein the slurry is held at a pH in the range of 2-12. An attractive feature of the inventive abrasive composition is that it can be tailored to selectively remove different components from the surface. The inventive abrasive composition also provides efficient polishing rates and good surface quality when used in CMP applications.
    Type: Application
    Filed: December 21, 2001
    Publication date: July 24, 2003
    Inventors: Yuzhuo Li, Guomin Bian, Kwok Tang, Joe Zunzi Zhao, John Westbrook, Yong Lin, Leina Chan