Abstract: A small-caliber ammunition is disclosed. The small-caliber ammunition includes a casing and a frangible projectile located within the casing. The frangible projectile includes a metal inert capsule and a reactive material (RM) pellet embedded within the metal inert capsule. The top surface of the RM pellet flushes with the top surface of the metal inert capsule. The casing contains a smokeless propellant and a primer for igniting the smokeless propellant.

Abstract: An underwater firearm is disclosed. The underwater firearm includes a barrel for receiving an ammunition on a first end and a barrel cap for covering a second end of the barrel. The underwater firearm also includes a capsule having a firing pin and contains a reactive material. The reactive material can be ignited by an electrical ignitor in order to propel the firing pin to strike the ammunition. A housing is utilized to contain the capsule and the electrical ignitor.

Abstract: A shot shell is disclosed. The shot shell includes a casing, a projectile, a cushion wad having a sabot, a propellant, and a primer for igniting the propellant. The projectile, the cushion and the propellant are contained within the casing. The projectile includes a reactive material pellet that is partially covered by a taper-shaped inert capsule.

Abstract: A shot shell is disclosed. The shot shell includes a casing, a projectile, a cushion wad having a sabot, a propellant, and a primer for igniting the propellant. The projectile, the cushion and the propellant are contained within the casing. The projectile includes a reactive material pellet that is partially covered by a taper-shaped inert capsule.

Abstract: A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Abstract: A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Abstract: A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Abstract: A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Abstract: A lighting system is presented that includes a replaceable illumination module removably coupled to a base module. The replaceable illumination module includes one or more solid state lighting elements on a printed circuit board electrically and thermally connected to the base module. The base module may include a heat sink, where the heat sink is in thermal contact with the replaceable illumination module, and dissipates heat generated by the one or more solid state lighting elements during operation of the lighting system. The replaceable illumination module may also include one or more beam conditioning elements for generating a specified beam. The lighting system may be connected to an automated control network and may be automatically controlled thereby, or may be used to control some other system. The heat sink may be generated via a dynamically controllable extrusion die.

Abstract: An edge area of the substrate processing device is disclosed. The edge area being processed is isolated from the remainder of the substrate by directing a flow of an inert gas through a plenum near the area to be processed thus forming a barrier while directing a flow of reactive species at an angle relative to the top surface of the substrate towards the substrate edge area thus processing the substrate edge area. A flow of oxygen containing gas into the processing chamber together with a negative exhaust pressure may contribute to the biasing of reactive species and other gases away from the non-processing areas of the substrate.

Abstract: Embodiments of the invention generally provide a method for enhancing chemical reactions within a substrate processing chamber during a substrate processing sequence. The method generally includes supporting a substrate in a face up position on a substrate support member, providing a process gas into the processing chamber, and striking a plasma of the process gas. The method further includes imparting at least one impulse to the substrate support member that is substantially perpendicular to a substrate surface, the at least one impulse being of sufficient magnitude to agitate the substrate surface to expand an exposed surface area of the substrate surface.

Abstract: Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support member in a direction that is substantially perpendicular to a surface of the substrate. The broadband impulse applied to the substrate support is calculated to be of sufficient magnitude to dislodge contamination particles from the surface of the substrate. The method further includes removing dislodged particles from an area proximate the substrate surface.

Abstract: Embodiments of the invention generally provide a processing system for removing contaminant particles from substrates. The processing system generally includes at least one processing enclosure having a particle removal assembly positioned therein. The particle removal assembly generally includes a substrate support member, a broadband actuator in communication with the substrate support member, and an air knife assembly positioned proximate the substrate support member. The air knife assembly is generally configured to generate a high pressure laminar flow of gas across the surface of the substrate.

Abstract: Embodiments of the invention generally provide a multistage semiconductor processing tool, wherein the processing tool includes a first transfer chamber having a first substrate transfer robot positioned therein and at least one load lock chamber in communication with the first transfer chamber. The at least one load lock is generally configured to communicate substrates into and out of the first transfer chamber. Further, the processing tool includes at least one substrate cleaning chamber positioned in communication with the first transfer chamber. The at least one substrate cleaning chamber generally includes a substrate support member, a broadband actuation device in communication with the substrate support member, and a particle removal device configured to sweep away dislodged particles from an area proximate the substrate surface.

Abstract: Embodiments of the invention generally provide an apparatus for removing particles from a substrate surface, wherein the apparatus includes a substrate support member configured to support a substrate thereon, and a broadband actuator in mechanical communication with the substrate support member. Additionally, an air knife assembly may be positioned proximate a perimeter of the substrate surface, and is configured to deliver a laminar stream of air across the substrate surface in order to remove the dislodged contamination particles therefrom. Alternatively, a plasma source may be used to remove dislodged particles from the area proximate the substrate surface.

Abstract: A method and apparatus for cleaning semiconductor wafers, next generation lithography (NGL) masks, and optical photomasks as well as test wafers and in service NGL and optical masks is disclosed. The method and apparatus utilize reactive gases and gas mixtures and mechanical agitation to enhance particle removal. The addition of a reactive gas process to an inert gas feed enhances the plasma cleaning process by breaking chemical bonds which form between surface particles and a substrate, consequently improving cleaning efficiency.

Abstract: Embodiments of the invention generally provide a processing system for removing contaminant particles from substrates. The processing system generally includes at least one processing enclosure having a particle removal assembly positioned therein. The particle removal assembly generally includes a substrate support member, a broadband actuator in communication with the substrate support member, and an air knife assembly positioned proximate the substrate support member. The air knife assembly is generally configured to generate a high pressure laminar flow of gas across the surface of the substrate.

Abstract: Embodiments of the invention generally provide a method and apparatus for removing contaminant particles from an interior surface of a processing chamber. The method generally includes imparting one or more broadband impulses to the processing chamber in a direction that is substantially perpendicular to an interior surface. The broadband impulses applied to the interior surface are calculated to be of sufficient magnitude to dislodge contamination particles from the interior surface. The method further includes removing dislodged particles from an area proximate the interior surface.

Abstract: Embodiments of the invention generally provide a multistage semiconductor processing tool, wherein the processing tool includes a first transfer chamber having a first substrate transfer robot positioned therein and at least one load lock chamber in communication with the first transfer chamber. The at least one load lock is generally configured to communicate substrates into and out of the first transfer chamber. Further, the processing tool includes at least one substrate cleaning chamber positioned in communication with the first transfer chamber. The at least one substrate cleaning chamber generally includes a substrate support member, a broadband actuation device in communication with the substrate support member, and a particle removal device configured to sweep away dislodged particles from an area proximate the substrate surface.

Abstract: Embodiments of the invention provide a method for removing contaminant particles from a substrate surface, where the method includes supporting a substrate in a face up position on a substrate support member and imparting a broadband impulse to the substrate support member in a direction that is substantially perpendicular to a surface of the substrate. The broadband impulse applied to the substrate support is calculated to be of sufficient magnitude to dislodge contamination particles from the surface of the substrate. The method further includes removing dislodged particles from an area proximate the substrate surface.