Patents by Inventor Joel Calvin Weber

Joel Calvin Weber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11933922
    Abstract: Hybrid subtractive-additive production of a superconducting multi-layer transition-edge sensor includes: forming a superconductor layer; forming a patterning photoresist on the superconductor layer; forming a sensor pattern in the patterning photoresist; subtractively forming, from the superconductor layer, the superconductor sensor layer; removing the patterning photoresist from the superconductor sensor layer; forming a template photoresist on the superconductor sensor layer; forming an inverse normal metal layer pattern in the template photoresist and exposing a bilayer portion of the superconductor sensor layer for addition of a normal metal layer; and additively forming the normal metal layer on the superconductor sensor layer such that the sensor pattern is interposed between the normal metal layer and the substrate.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: March 19, 2024
    Assignee: GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE
    Inventors: Daniel Richard Schmidt, Joel Calvin Weber
  • Publication number: 20210278551
    Abstract: Hybrid subtractive-additive production of a superconducting multi-layer transition-edge sensor includes: forming a superconductor layer; forming a patterning photoresist on the superconductor layer; forming a sensor pattern in the patterning photoresist; subtractively forming, from the superconductor layer, the superconductor sensor layer; removing the patterning photoresist from the superconductor sensor layer; forming a template photoresist on the superconductor sensor layer; forming an inverse normal metal layer pattern in the template photoresist and exposing a bilayer portion of the superconductor sensor layer for addition of a normal metal layer; and additively forming the normal metal layer on the superconductor sensor layer such that the sensor pattern is interposed between the normal metal layer and the substrate.
    Type: Application
    Filed: March 5, 2021
    Publication date: September 9, 2021
    Inventors: Daniel Richard Schmidt, Joel Calvin Weber