Patents by Inventor Joel D. Stolfus
Joel D. Stolfus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7915886Abstract: A first magnetic sensor produces a first output signal in response to movement of a target such as a multi-pole ring magnet, and a second magnetic sensor produces a second output signal in response to movement of the target. The first and second magnetic sensors may be corresponding magnetoresistor sensors, the first and second magnetic sensors may be intertwined, the first and second magnetic sensors may be oriented at an angle with respect to one another so as to produce a difference in phase between the first and second output signals, the first and second magnetic sensors may be arranged so as to produce a 90° phase difference between the first and second output signals, and/or the first and second magnetic sensors may be formed on a semiconductor substrate.Type: GrantFiled: January 29, 2007Date of Patent: March 29, 2011Assignee: Honeywell International Inc.Inventors: Joel D. Stolfus, Jason M. Chilcote
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Patent number: 7834616Abstract: A first magnetic sensor is formed on a semiconductor substrate, and the first magnetic sensor produces a first output signal in response to movement of a multi-pole magnet. A second magnetic sensor is formed on the semiconductor substrate so as to be intertwined with the first magnetic sensor and so as to be at a predetermined angle with respect to the first magnetic sensor. The second magnetic sensor produces a second output signal in response to movement of the multi-pole magnet. The predetermined angle is between 0° and 180° exclusive, and the predetermined angle is sufficient to produce a difference in phase between the first and second output signals. An output signal converter converts the first and second output signals to a linear signal.Type: GrantFiled: February 22, 2007Date of Patent: November 16, 2010Assignee: Honeywell International Inc.Inventors: Joel D. Stolfus, Jason M. Chilcote
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Publication number: 20080180090Abstract: A first magnetic sensor is formed on a semiconductor substrate, and the first magnetic sensor produces a first output signal in response to movement of a multi-pole magnet. A second magnetic sensor is formed on the semiconductor substrate so as to be intertwined with the first magnetic sensor and so as to be at a predetermined angle with respect to the first magnetic sensor. The second magnetic sensor produces a second output signal in response to movement of the multi-pole magnet. The predetermined angle is between 0° and 180° exclusive, and the predetermined angle is sufficient to produce a difference in phase between the first and second output signals. An output signal converter converts the first and second output signals to a linear signal.Type: ApplicationFiled: February 22, 2007Publication date: July 31, 2008Inventors: Joel D. Stolfus, Jason M. Chilcote
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Publication number: 20080180089Abstract: A first magnetic sensor produces a first output signal in response to movement of a target such as a multi-pole ring magnet, and a second magnetic sensor produces a second output signal in response to movement of the target. The first and second magnetic sensors may be corresponding magnetoresistor sensors, the first and second magnetic sensors may be intertwined, the first and second magnetic sensors may be oriented at an angle with respect to one another so as to produce a difference in phase between the first and second output signals, the first and second magnetic sensors may be arranged so as to produce a 90° phase difference between the first and second output signals, and/or the first and second magnetic sensors may be formed on a semiconductor substrate.Type: ApplicationFiled: January 29, 2007Publication date: July 31, 2008Inventors: Joel D. Stolfus, Jason M. Chilcote
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Patent number: 7378721Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g., a magnetoresistive component) or sense die.Type: GrantFiled: December 5, 2005Date of Patent: May 27, 2008Assignee: Honeywell International Inc.Inventors: Lawrence E. Frazee, Wayne A. Lamb, John S. Patin, Peter A. Schelonka, Joel D. Stolfus
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Patent number: 7375406Abstract: A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy and/or solder can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e.g.Type: GrantFiled: December 20, 2005Date of Patent: May 20, 2008Assignee: Honeywell International Inc.Inventors: Wayne A. Lamb, Scott E. Michelhaugh, Peter A. Schelonka, Joel D. Stolfus
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Patent number: 7269992Abstract: A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.Type: GrantFiled: June 15, 2005Date of Patent: September 18, 2007Assignee: Honeywell International Inc.Inventors: Wayne A. Lamb, Lawrence E. Frazee, Peter A. Schelonka, Joel D. Stolfus
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Patent number: 6798193Abstract: A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit.Type: GrantFiled: August 14, 2002Date of Patent: September 28, 2004Assignee: Honeywell International Inc.Inventors: Mike W. Zimmerman, Lamar F. Ricks, Curtis B. Johnson, Joel D. Stolfus, Douglas L. Mueller
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Patent number: 6771063Abstract: A system for improving the duty cycle output of a vehicle speed sensor circuit is disclosed. The vehicle speed sensor circuit can be configured, for example as a binary counter, to provide a particular number of pulses per distance of vehicle travel. An output of the vehicle speed sensor circuit is generally divided by placing varying values on particular load pins of an associated counter circuit, thereby providing a substantially improved duty cycle output from the vehicle speed sensor circuit, which is independent of an associated sensor duty cycle. The output of the vehicle speed sensor circuit can be divided utilizing a toggle flip-flop circuit integrated with the vehicle speed sensor circuit. The toggle flip-flop can be configured as an edge-triggered toggle flip-flop. The vehicle speed sensor can be utilized to sense rotating members present in a vehicle. The vehicle speed sensor thus provides a digital pulse output for every tooth that passes in front of the vehicle speed sensor.Type: GrantFiled: November 15, 2001Date of Patent: August 3, 2004Assignee: Honeywell International Inc.Inventor: Joel D. Stolfus
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Patent number: 6727689Abstract: An apparatus and method for detecting gear features is provided. The apparatus includes a magnetic-sensing element, a thresholding module, and an output module. The magnetic-sensing element may provide a sensor-output signal indicative of the presence of a gear feature. The thresholding module may (i) transform the sensor-output signal into a characteristic waveform, which is also indicative of the presence of the gear feature; (ii) detect a first difference between the characteristic waveform and a reference signal, and responsively provide a tracking signal that tracks this difference; and (iii) detect a second difference between the tracking and reference signals, and responsively adjust the sensor-output signal. Adjustment may be performed (i) as a function of the second difference when it falls below a given threshold and (ii) by a predetermined amount when the second difference satisfies the given threshold.Type: GrantFiled: July 24, 2003Date of Patent: April 27, 2004Assignee: Honeywell International Inc.Inventors: Greg R. Furlong, Joel D. Stolfus, Jason M. Chilcote, Scott L. Bunyer
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Publication number: 20040032251Abstract: A calibrated, low-profile magnetic sensor and method for forming such a sensor are described herein. Generally, a magnetic sensing device is formed within a housing, wherein the magnetic sensing device comprises at least one magnet. The magnetic sensor includes a compact integrated circuit package such as, for example, a small outline integrated circuit package (SOIC). A magnetic sensing element is generally mounted to the compact integrated circuit package. The magnetic sensing device can be configured to additionally incorporate a printed circuit board (PCB) having a hole formed therein such that the compact integrated circuit package can be surface mounted off-center on the printed circuit board, so that the hole can be located within the printed circuit board to match a shape of the magnet, allowing the magnet to pass through the circuit board adjacent to the SOIC to complete the magnetic circuit.Type: ApplicationFiled: August 14, 2002Publication date: February 19, 2004Inventors: Mike W. Zimmerman, Lamar F. Ricks, Curtis B. Johnson, Joel D. Stolfus, Douglas L. Mueller
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Publication number: 20040018914Abstract: Methods and systems for detecting the linear movement of a shaft utilizing at least two geartooth sensors and two gears, one helical gear and one a normal spur gear are disclosed. As the shaft and gears translate in a linear direction, they are also rotating. Due to the fact one gear is a helical gear and the other is not, as the shaft translates mechanically, there will be a change in the phase between the output of a first geartooth sensor with respect to the second geartooth sensor. This change in phase is converted into linear travel using a simple calculation to detect the linear translation of the shaft.Type: ApplicationFiled: July 29, 2002Publication date: January 29, 2004Inventor: Joel D. Stolfus
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Publication number: 20030090260Abstract: A method and system for improving the duty cycle output of a vehicle speed sensor circuit is disclosed. The vehicle speed sensor circuit can be configured, for example as a binary counter, to provide a particular number of pulses per distance of vehicle travel. An output of the vehicle speed sensor circuit is generally divided by placing varying values on particular load pins of an associated counter circuit, thereby providing a substantially improved duty cycle output from the vehicle speed sensor circuit, which is independent of an associated sensor duty cycle. The output of the vehicle speed sensor circuit can be divided utilizing a toggle flip-flop circuit integrated with the vehicle speed sensor circuit. The toggle flip-flop can be configured as an edge-triggered toggle flip-flop. The vehicle speed sensor can be utilized to sense rotating members present in a vehicle. The vehicle speed sensor thus provides a digital pulse output for every tooth that passes in front of the vehicle speed sensor.Type: ApplicationFiled: November 15, 2001Publication date: May 15, 2003Inventor: Joel D. Stolfus
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Patent number: 5729128Abstract: A magnetic sensor is provided which utilizes a molded magnet with a channel formed therein. A magnetically sensitive component, such as a Hall effect element, is attached to a substrate or printed circuit board. The printed circuit board, or substrate, is provided with an opening through its thickness that is shaped to accept a post with a certain amount of clearance therebetween. This allows the printed circuit board to be moved relative to the magnet during calibration procedures and then rigidly attached in a position relative to the magnet by soldering the post to the substrate or printed circuit board. This places the magnetically sensitive component at a desirable location relative to the magnet and within the channel formed in the magnet. The post can be molded into the magnet or formed as an integral portion of the magnet.Type: GrantFiled: November 22, 1996Date of Patent: March 17, 1998Assignee: Honeywell Inc.Inventors: Scott L. Bunyer, Nicholas F. Busch, Joel D. Stolfus
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Patent number: 5140262Abstract: An off axis geartooth sensor is provided with a center line of the sensor disposed along a line which is not coincident with the center of rotation of the rotatable member to be sensed. Instead, the center line of the housing in which a Hall Effect element is disposed is positioned at a perpendicular distance from the center of rotation of the rotatable member which is determined as the function of a range of dimensions which define the allowable gap between the Hall Effect element and a surface of the rotatable member. The perpendicular distance between the center of rotation and the line along which the proximity sensor is disposed is mathematically determined as a function of the distances between the center of rotation of the rotatable member and the minimum and maximum possible locations of the Hall Effect element along with the angular distance between those two dimensions.Type: GrantFiled: July 2, 1991Date of Patent: August 18, 1992Assignee: Honeywell Inc.Inventor: Joel D. Stolfus